GigaDevice_GD25B512MEY2GR
GigaDevice_GD25B512MEY2GR
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GigaDevice
GD25B512MEY2GR

774-GD25B512MEY2GR
IC FLASH 512MBIT SPI/QUAD 8WSON
14 Weeks

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Tech Specifications

Clock Frequency
133 MHz
Operating Temperature
-40°C ~ 105°C (TA)
Memory Interface
SPI - Quad I/O, QPI, DTR
Memory Organization
64M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
8-WSON (6x8)
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GD25B512MEY2GR Description

GD25B512MEY2GR Description

The GD25B512MEY2GR is a high-performance, 512Mbit SPI/QUAD flash memory IC from GigaDevice Semiconductor (HK) Limited, designed for a wide range of applications requiring reliable and efficient data storage solutions. This memory IC chip is part of the GD25B series and features a memory organization of 64M x 8, providing ample storage capacity in a compact and efficient package. The GD25B512MEY2GR operates at a clock frequency of 133 MHz, ensuring fast data transfer rates and low latency, making it ideal for applications that demand high-speed performance. The device supports a supply voltage range of 2.7V to 3.6V, offering flexibility in power supply requirements and ensuring compatibility with various electronic systems.

GD25B512MEY2GR Features

  • High-Speed Performance: The GD25B512MEY2GR operates at a clock frequency of 133 MHz, providing fast read and write speeds that are essential for high-performance applications.
  • Large Memory Capacity: With a memory size of 512Mbit and a memory organization of 64M x 8, this IC offers substantial storage capacity, making it suitable for applications that require large amounts of data storage.
  • Flexible Power Supply: The device operates within a voltage range of 2.7V to 3.6V, providing flexibility in power supply requirements and ensuring compatibility with various electronic systems.
  • Surface Mount Technology: The GD25B512MEY2GR is designed for surface mount applications, making it ideal for compact and space-constrained designs.
  • SPI/QUAD Interface: The IC supports both SPI and QUAD interfaces, offering enhanced data transfer capabilities and compatibility with a wide range of systems.
  • Tape & Reel Packaging: The GD25B512MEY2GR is available in tape & reel packaging (TR), which is suitable for automated assembly processes and ensures high reliability and consistency in production.
  • Active Product Status: This product is currently active, ensuring availability and support for ongoing and future projects.

GD25B512MEY2GR Applications

The GD25B512MEY2GR is well-suited for a variety of applications across different industries, including:

  • Consumer Electronics: Ideal for devices such as smartphones, tablets, and digital cameras, where high-speed data storage and retrieval are critical.
  • Industrial Systems: Suitable for industrial control systems, automation equipment, and IoT devices that require reliable and efficient data storage solutions.
  • Telecommunications: Perfect for applications in the telecommunications industry, such as base stations and networking equipment, where fast and reliable data storage is essential.
  • Automotive: Can be used in automotive applications, such as infotainment systems and advanced driver-assistance systems (ADAS), where high-speed data processing and storage are required.
  • Medical Devices: Ideal for medical devices that require fast and reliable data storage, such as diagnostic equipment and wearable health monitors.

Conclusion of GD25B512MEY2GR

The GD25B512MEY2GR from GigaDevice Semiconductor (HK) Limited is a high-performance, 512Mbit SPI/QUAD flash memory IC that offers a combination of large storage capacity, high-speed performance, and flexible power supply options. Its surface mount technology and tape & reel packaging make it suitable for a wide range of applications, from consumer electronics to industrial systems. The GD25B512MEY2GR's unique features and advantages over similar models make it an ideal choice for applications that demand reliable and efficient data storage solutions.

FAQ

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The standard lead time for GD25B512MEY2GR is 14 Weeks.
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