Infineon Technologies
BGA231L7E6327

860-BGA231L7E6327
PDF Datasheet
IC AMP GALI 1.55-1.615GHZ TSLP7

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ISO9001
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Tech Specifications

ECCN
EAR99
Mounting Type
Surface Mount
Current - Supply
4.4mA
Product Status
Active
Supplier Device Package
PG-TSLP-7-1
Series
-
Package / Case
6-XFDFN Exposed Pad
Voltage - Supply
1.5V ~ 3.6V
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BGA231L7E6327 Description

With a vision to drive innovation and transform industries, the Bulk in this BGA231L7E6327 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. Infineon Technologies is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This Infineon Technologies BGA231L7E6327 falls into the RF Amplifiers which is a subset of RF and Wireless. This BGA231L7E6327 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

FAQ

What package or case is BGA231L7E6327 available in?
BGA231L7E6327 is available in the 6-XFDFN Exposed Pad package / case.
Are there related or alternative parts for BGA231L7E6327?
Is BGA231L7E6327 currently in stock?
What is the mounting type of BGA231L7E6327?
What voltage specification is listed for BGA231L7E6327?
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