Infineon Technologies_BGA771L16E6327XTSA1
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Infineon Technologies
BGA771L16E6327XTSA1

860-BGA771L16E6327XTSA1
PDF Datasheet
IC AMP UMTS 800MHZ 900MHZ TSLP16

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Tech Specifications

ECCN
EAR99
Mounting Type
Surface Mount
Current - Supply
3.4mA
Product Status
Obsolete
Supplier Device Package
TSLP-16-1
Series
-
Package / Case
16-XFQFN Exposed Pad
Voltage - Supply
2.7V ~ 3V
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BGA771L16E6327XTSA1 Description

With a vision to drive innovation and transform industries, the Tape & Reel (TR) in this BGA771L16E6327XTSA1 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. Infineon Technologies is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This Infineon Technologies BGA771L16E6327XTSA1 falls into the RF Amplifiers which is a subset of RF and Wireless. This BGA771L16E6327XTSA1 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

FAQ

What is the mounting type of BGA771L16E6327XTSA1?
BGA771L16E6327XTSA1 uses a Surface Mount mounting style based on the listed product specifications.
Is BGA771L16E6327XTSA1 currently in stock?
What voltage specification is listed for BGA771L16E6327XTSA1?
What is BGA771L16E6327XTSA1?
Are there related or alternative parts for BGA771L16E6327XTSA1?
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