


Infineon Technologies
BGB717L7ESDE6327XTSA1
860-BGB717L7ESDE6327XTSA1
PDF Datasheet
IC AMP FM 76MHZ-108MHZ TSLP7-1
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Responsible qualityTech Specifications
ECCN
EAR99
Mounting Type
Surface Mount
Supply Current
3mA
Product Status
Obsolete
Supplier Device Package
PG-TSLP-7-1
Series
-
Package / Case
6-XFDFN Exposed Pad
Supply Voltage
1.8V ~ 4V
BGB717L7ESDE6327XTSA1 Description
With a vision to drive innovation and transform industries, the Tape & Reel (TR) in this BGB717L7ESDE6327XTSA1 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. Infineon Technologies is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This Infineon Technologies BGB717L7ESDE6327XTSA1 falls into the RF Amplifiers which is a subset of RF and Wireless. This BGB717L7ESDE6327XTSA1 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.
FAQ
What operating temperature range does BGB717L7ESDE6327XTSA1 support?
BGB717L7ESDE6327XTSA1 has an operating temperature range of 150.
What package or case is BGB717L7ESDE6327XTSA1 available in?
What is the mounting type of BGB717L7ESDE6327XTSA1?
Are there related or alternative parts for BGB717L7ESDE6327XTSA1?
What voltage specification is listed for BGB717L7ESDE6327XTSA1?



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