Infineon Technologies_BGA 700L16 E6327
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Infineon Technologies
BGA 700L16 E6327

860-BGA 700L16 E6327
PDF Datasheet
IC AMP GSM 500MHZ-6GHZ TSLP7-1

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Tech Specifications

ECCN
EAR99
Mounting Type
Surface Mount
Current - Supply
-
Product Status
Obsolete
Supplier Device Package
PG-TSLP-7-1
Series
-
Package / Case
6-XFDFN Exposed Pad
Voltage - Supply
2.75V
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BGA 700L16 E6327 Description

With a vision to drive innovation and transform industries, the Tape & Reel (TR) in this BGA 700L16 E6327 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. Infineon Technologies is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This Infineon Technologies BGA 700L16 E6327 falls into the RF Amplifiers which is a subset of RF and Wireless. This BGA 700L16 E6327 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.

FAQ

What is the mounting type of BGA 700L16 E6327?
BGA 700L16 E6327 uses a Surface Mount mounting style based on the listed product specifications.
Are there related or alternative parts for BGA 700L16 E6327?
Is BGA 700L16 E6327 currently in stock?
What is BGA 700L16 E6327?
What voltage specification is listed for BGA 700L16 E6327?
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