


Infineon Technologies
BGA736L16E6327XTSA1
860-BGA736L16E6327XTSA1
PDF Datasheet
IC AMP W-CDMA 800/900MHZ TSLP16
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Responsible qualityTech Specifications
ECCN
EAR99
Mounting Type
Surface Mount
Supply Current
5.3mA
Product Status
Obsolete
Supplier Device Package
TSLP-16-1
Series
-
Package / Case
16-XFQFN Exposed Pad
Supply Voltage
2.7V ~ 3V
BGA736L16E6327XTSA1 Description
With a vision to drive innovation and transform industries, the Tape & Reel (TR) in this BGA736L16E6327XTSA1 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. Infineon Technologies is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This Infineon Technologies BGA736L16E6327XTSA1 falls into the RF Amplifiers which is a subset of RF and Wireless. This BGA736L16E6327XTSA1 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.
FAQ
What voltage specification is listed for BGA736L16E6327XTSA1?
The listed voltage-related specification for BGA736L16E6327XTSA1 is 2.7V ~ 3V.
Is BGA736L16E6327XTSA1 currently in stock?
Are there related or alternative parts for BGA736L16E6327XTSA1?
What is the mounting type of BGA736L16E6327XTSA1?
What package or case is BGA736L16E6327XTSA1 available in?



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