


Infineon Technologies
BGA777L7E6327XTSA1
860-BGA777L7E6327XTSA1
PDF Datasheet
IC AMP UMTS 2.3/2.7GHZ TSLP7-1
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Responsible qualityTech Specifications
ECCN
EAR99
Mounting Type
Surface Mount
Supply Current
10mA
Product Status
Obsolete
Supplier Device Package
PG-TSLP-7-1
Series
-
Package / Case
6-XFDFN Exposed Pad
Supply Voltage
2.6V ~ 3V
BGA777L7E6327XTSA1 Description
With a vision to drive innovation and transform industries, the Tape & Reel (TR) in this BGA777L7E6327XTSA1 plays a crucial role in enabling the Internet of Things (IoT), smart cities, autonomous vehicles, and more. Infineon Technologies is the manufacturer of this electronic component and is committed to creating high-performance chips to meet consumer demands effectively. RF and Wireless is a cutting-edge technology package that revolutionizes the way we communicate and connect in today's digital world. This Infineon Technologies BGA777L7E6327XTSA1 falls into the RF Amplifiers which is a subset of RF and Wireless. This BGA777L7E6327XTSA1 ‘s applications are vast and diverse, spanning telecommunications, healthcare, transportation, manufacturing, and beyond. By leveraging RF and Wireless technology, products can achieve greater efficiency, reliability, and convenience, ultimately enhancing the overall user experience.
FAQ
Is BGA777L7E6327XTSA1 currently in stock?
BGA777L7E6327XTSA1 is currently available on an inquiry basis. Please contact us for the latest stock information.
What voltage specification is listed for BGA777L7E6327XTSA1?
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What is BGA777L7E6327XTSA1?



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