Intel_10AX066H3F34E2SG
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Intel
10AX066H3F34E2SG

696-10AX066H3F34E2SG
PDF Datasheet
Field Programmable Gate Array, 660000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
12 Weeks

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Tech Specifications

Max Operating Temperature
100
Number of Terminals
1152
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B1152
Width
35
Length
35
Temperature Grade
OTHER
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10AX066H3F34E2SG Description

10AX066H3F34E2SG Description

The 10AX066H3F34E2SG is a high-performance Arria 10 GX series FPGA from Intel, designed for demanding applications requiring high logic density and power efficiency. Packaged in a 1152-FBGA form factor, this surface-mount device features 660,000 logic elements, 49.6 Mb of total RAM, and 492 I/O pins, making it ideal for complex digital designs. Operating within a 0.87V–0.93V supply range and a 0°C–100°C (TJ) temperature range, it balances power efficiency with robust thermal performance. Its RoHS compliance and REACH-unaffected status ensure adherence to environmental regulations, while its MSL 3 (168 hours) rating guarantees reliability in manufacturing workflows.

10AX066H3F34E2SG Features

  • High Logic Density: 660K logic elements and 250,540 LABs/CLBs enable intricate digital signal processing and parallel computing.
  • Ample Memory Resources: 49.6 Mb RAM supports high-bandwidth data buffering and real-time processing.
  • Power Efficiency: Low-voltage operation (0.87V–0.93V) reduces dynamic power consumption, critical for portable and embedded systems.
  • Robust I/O Capability: 492 I/O pins facilitate versatile interfacing with peripherals, sensors, and high-speed transceivers.
  • Industrial Reliability: ECCN 3A001A7B compliance ensures suitability for aerospace, defense, and telecom applications.
  • Advanced Packaging: 1152-FBGA offers superior thermal dissipation and mechanical stability for high-density PCB designs.

10AX066H3F34E2SG Applications

  • Data Acceleration: Ideal for AI/ML inference, data center acceleration, and high-performance computing (HPC) due to its parallel processing capabilities.
  • Communications Infrastructure: Supports 5G baseband processing, optical networking, and software-defined radio (SDR) with its high-speed I/O and memory bandwidth.
  • Industrial Automation: Enables real-time control systems, motor drives, and robotics with low-latency logic execution.
  • Military/Aerospace: Compliant with ECCN 3A001A7B, suitable for radar, EW (electronic warfare), and secure communications.
  • Video Processing: Optimized for 4K/8K video encoding/decoding and broadcast equipment.

Conclusion of 10AX066H3F34E2SG

The 10AX066H3F34E2SG stands out as a versatile, high-density FPGA, combining Intel’s Arria 10 GX architecture with power-efficient operation and industrial-grade reliability. Its 660K logic elements, 49.6 Mb RAM, and 492 I/Os make it a top choice for compute-intensive applications in telecom, defense, and embedded systems. With RoHS compliance and MSL 3 certification, it ensures seamless integration into rigorous production environments. Engineers seeking a balance of performance, power, and scalability will find this FPGA a compelling solution.

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10AX066H3F34E2SG has an operating temperature range of 100.
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