Intel_1SX165HU3F50I2VG
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Intel
1SX165HU3F50I2VG

777-1SX165HU3F50I2VG
IC FPGA STRATIX 10 2397FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Speed
1.5GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Product Status
Active
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1SX165HU3F50I2VG Description

1SX165HU3F50I2VG Description

The 1SX165HU3F50I2VG is a high-performance Embedded IC Chip from Intel, part of the Stratix® 10 SX series. This device is designed to deliver exceptional performance and versatility for a wide range of embedded applications. With a clock speed of 1.5GHz, it offers robust processing capabilities, making it ideal for demanding computational tasks. The architecture combines the flexibility of an MCU with the programmability of an FPGA, providing a powerful platform for complex system designs.

1SX165HU3F50I2VG Features

  • Speed: The 1.5GHz clock speed ensures rapid processing, making it suitable for real-time applications and high-speed data processing.
  • Architecture: The combination of MCU and FPGA architecture offers a unique blend of flexibility and programmability, allowing for both general-purpose processing and specialized, custom logic implementation.
  • RAM Size: With 256KB of RAM, the device can handle substantial data storage and processing tasks, ensuring efficient memory management.
  • Peripherals: The inclusion of DMA (Direct Memory Access) and WDT (Watchdog Timer) enhances system reliability and performance, providing efficient data transfer and system monitoring.
  • Connectivity: The device supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for various communication protocols and interfaces.
  • Package: The Tray packaging ensures reliable handling and storage, while the Moisture Sensitivity Level (MSL) of 3 (168 Hours) indicates its robustness against environmental factors.
  • Product Status: The 1SX165HU3F50I2VG is an active product, ensuring continued support and availability for ongoing projects.
  • REACH Status: The device is REACH unaffected, ensuring compliance with environmental and safety regulations.

1SX165HU3F50I2VG Applications

The 1SX165HU3F50I2VG is ideal for a variety of applications due to its powerful and flexible architecture. Some specific use cases include:

  • Industrial Automation: The combination of high-speed processing and extensive connectivity options makes it suitable for controlling complex machinery and systems.
  • Telecommunications: The device can be used in base stations and other communication infrastructure for efficient data processing and transmission.
  • Automotive: The robustness and reliability of the device make it ideal for automotive applications, such as advanced driver assistance systems (ADAS) and infotainment systems.
  • Medical Devices: The high performance and reliability of the 1SX165HU3F50I2VG make it suitable for medical imaging and diagnostic equipment.
  • Consumer Electronics: The device can be used in high-end consumer electronics, such as smart TVs and gaming consoles, for enhanced processing and connectivity.

Conclusion of 1SX165HU3F50I2VG

The 1SX165HU3F50I2VG from Intel is a versatile and powerful Embedded IC Chip, offering a unique blend of MCU and FPGA capabilities. Its high clock speed, substantial RAM, and extensive connectivity options make it suitable for a wide range of applications, from industrial automation to consumer electronics. The device's robustness and compliance with environmental regulations further enhance its appeal. For engineers and designers seeking a reliable and high-performance solution, the 1SX165HU3F50I2VG is an excellent choice.

FAQ

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The standard lead time for 1SX165HU3F50I2VG is 12 Weeks.
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