Intel_1SX210HN3F43E2VG
original

Intel
1SX210HN3F43E2VG

777-1SX210HN3F43E2VG
IC FPGA STRATIX 10 1760FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Speed
1.5GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Product Status
Active
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1SX210HN3F43E2VG Description

1SX210HN3F43E2VG Description

The 1SX210HN3F43E2VG is a high-performance Embedded IC Chip from Intel, belonging to the Stratix® 10 SX series. This FPGA is designed to deliver exceptional performance and flexibility, making it ideal for a wide range of embedded applications. With a clock speed of 1.5GHz, the 1SX210HN3F43E2VG ensures rapid processing capabilities, crucial for real-time systems and high-speed data processing tasks.

The operating temperature range of 0°C to 100°C (TJ) makes this chip suitable for use in various environments, from industrial settings to consumer electronics. The architecture combines the power of a Microcontroller Unit (MCU) with the flexibility of a Field-Programmable Gate Array (FPGA), providing a versatile platform for complex system designs. The 256KB of RAM ensures ample memory for handling multiple tasks simultaneously, enhancing overall system efficiency.

1SX210HN3F43E2VG Features

The 1SX210HN3F43E2VG boasts a comprehensive set of peripherals, including DMA (Direct Memory Access), WDT (Watchdog Timer), and connectivity options such as EBI/EMI (External Bus Interface/External Memory Interface), Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART and, USB OTG. These features enable seamless integration with other components and systems, facilitating robust and interconnected designs.

The product is packaged in a tray format, ensuring safe handling and storage. The Moisture Sensitivity Level (MSL) of 3 (168 hours) indicates that the chip is protected against moisture damage, which is essential for maintaining reliability during manufacturing processes.

1SX210HN3F43E2VG Applications

The 1SX210HN3F43E2VG is ideal for applications that require high computational power and flexibility. Its combination of MCU and FPGA architecture makes it suitable for complex embedded systems, such as industrial automation, automotive electronics, and advanced communication systems. The extensive connectivity options allow for seamless integration with various peripherals, making it a versatile choice for designers looking to build robust and interconnected systems.

Specific use cases include:

  • Industrial Automation: The high speed and extensive connectivity options make it ideal for controlling complex machinery and systems.
  • Automotive Electronics: The robustness and flexibility of the 1SX210HN3F43E2VG make it suitable for advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.
  • Communication Systems: The Ethernet and USB OTG connectivity options enable the development of high-speed communication devices and network infrastructure components.

Conclusion of 1SX210HN3F43E2VG

The 1SX210HN3F43E2VG from Intel is a powerful and versatile Embedded IC Chip that offers a unique combination of high-speed processing, extensive connectivity, and robust architecture. Its wide operating temperature range and moisture sensitivity protection ensure reliability in various environments. The comprehensive set of peripherals and connectivity options make it an ideal choice for a wide range of applications, from industrial automation to automotive electronics. The 1SX210HN3F43E2VG stands out as a reliable and high-performance solution for designers looking to build advanced embedded systems.

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The standard lead time for 1SX210HN3F43E2VG is 12 Weeks.
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