Intel_1SX210HU3F50E3VG
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Intel
1SX210HU3F50E3VG

777-1SX210HU3F50E3VG
IC FPGA STRATIX 10 2397FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Speed
1.5GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Product Status
Active
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1SX210HU3F50E3VG Description

1SX210HU3F50E3VG Description

The 1SX210HU3F50E3VG is an advanced embedded IC chip from Intel's Stratix® 10 SX series, designed to deliver exceptional performance and reliability in a wide range of embedded applications. This IC features a powerful 1.5GHz processing speed and operates within a temperature range of 0°C to 100°C (TJ), making it suitable for demanding industrial and automotive environments. The architecture combines a microcontroller unit (MCU) with a field-programmable gate array (FPGA), offering versatile programmability and high computational efficiency.

With 256KB of RAM, the 1SX210HU3F50E3VG provides ample memory for complex operations and data handling. The chip is equipped with a comprehensive suite of peripherals, including DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance system performance and reliability. The product is currently active, ensuring continued support and availability.

The 1SX210HU3F50E3VG is REACH unaffected, adhering to stringent environmental and safety standards. It is manufactured by Intel, a leading provider of semiconductor solutions, and is packaged in a tray format with a moisture sensitivity level (MSL) of 3 (168 hours), ensuring robustness during storage and transportation.

1SX210HU3F50E3VG Features

  • High-Speed Processing: The 1.5GHz speed ensures rapid execution of complex algorithms and real-time processing tasks.
  • Wide Operating Temperature Range: Suitable for applications in extreme environments, from freezing to high-temperature conditions.
  • Hybrid Architecture: Combines the flexibility of an MCU with the parallel processing capabilities of an FPGA, offering a versatile solution for various embedded systems.
  • Robust Memory: 256KB of RAM supports efficient data handling and execution of multiple tasks simultaneously.
  • Comprehensive Peripherals: Features DMA and WDT, which enhance system performance and reliability by managing memory transfers and monitoring system operations.
  • Active Product Status: Ensures ongoing support, updates, and availability for long-term projects.
  • Environmental Compliance: REACH unaffected, ensuring compliance with environmental regulations and safety standards.
  • Advanced Connectivity: Supports a wide range of interfaces including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various peripheral devices.
  • Reliable Packaging: Tray packaging with an MSL of 3 (168 hours) ensures the chip remains protected during storage and transportation.

1SX210HU3F50E3VG Applications

The 1SX210HU3F50E3VG is ideal for a variety of applications that require high performance, reliability, and flexibility. Its hybrid architecture and extensive connectivity options make it suitable for:

  • Industrial Automation: Enhances the efficiency and reliability of industrial control systems, enabling real-time data processing and control.
  • Automotive Systems: Ideal for automotive applications where high performance and wide operating temperature ranges are critical.
  • Telecommunications: Supports the development of advanced communication systems with high-speed data processing and reliable connectivity.
  • Medical Devices: Ensures precise control and data processing in medical equipment, contributing to improved patient care.
  • Consumer Electronics: Powers smart devices with high-speed processing and efficient memory management.
  • IoT and Edge Computing: Facilitates the development of intelligent IoT devices and edge computing solutions, enabling efficient data processing at the edge.

Conclusion of 1SX210HU3F50E3VG

The 1SX210HU3F50E3VG is a versatile and high-performance embedded IC chip that stands out in its category due to its hybrid architecture, robust memory, and extensive connectivity options. Its wide operating temperature range and compliance with environmental standards make it a reliable choice for a variety of demanding applications. Whether used in industrial automation, automotive systems, or consumer electronics, the 1SX210HU3F50E3VG offers significant advantages over similar models, ensuring superior performance and reliability.

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What is 1SX210HU3F50E3VG?
1SX210HU3F50E3VG is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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