Intel_1SX250HH1F55I1VG
original

Intel
1SX250HH1F55I1VG

777-1SX250HH1F55I1VG
IC FPGA STRATIX 10 2912FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Speed
1.5GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Product Status
Active
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1SX250HH1F55I1VG Description

1SX250HH1F55I1VG Description

The 1SX250HH1F55I1VG is a high-performance Embedded IC Chip from Intel's Stratix® 10 SX series, designed to meet the demands of modern embedded systems. This IC integrates a powerful 1.5GHz processor with a versatile architecture that combines both MCU and FPGA capabilities. The device features 256KB of onboard RAM, providing ample memory for complex applications. It also includes a range of peripherals such as DMA and WDT, enhancing its functionality and reliability.

With a product status of Active and REACH Unaffected, the 1SX250HH1F55I1VG ensures compliance with industry standards and environmental regulations. The device is packaged in a Tray format with a Moisture Sensitivity Level (MSL) of 3, allowing for 168 hours of safe storage before assembly.

1SX250HH1F55I1VG Features

Technical Specifications

  • Speed: 1.5GHz
  • Architecture: MCU, FPGA
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Package: Tray
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)

Performance Benefits

The 1SX250HH1F55I1VG offers several unique features that set it apart from similar models:

  • Dual Architecture: The combination of MCU and FPGA allows for both high-speed processing and flexible programmability, making it suitable for a wide range of applications.
  • Robust Connectivity: With support for multiple communication protocols, including Ethernet, I2C, SPI, and USB OTG, the device can easily integrate into complex systems.
  • Enhanced Memory: The 256KB of RAM ensures efficient data handling and processing, even for demanding applications.
  • Reliability: Features like DMA and WDT enhance the device's reliability and performance in critical applications.

1SX250HH1F55I1VG Applications

The 1SX250HH1F55I1VG is ideal for a variety of applications due to its versatile architecture and robust feature set. Some specific use cases include:

  • Industrial Automation: The device's high-speed processing and connectivity options make it suitable for controlling complex machinery and systems.
  • Embedded Systems: The combination of MCU and FPGA capabilities allows for the development of highly customized and efficient embedded solutions.
  • Networking: The extensive connectivity options, including Ethernet and USB OTG, make it ideal for networked devices and IoT applications.
  • Consumer Electronics: The device's flexibility and performance make it a strong candidate for applications in consumer electronics, such as smart home devices and wearable technology.

Conclusion of 1SX250HH1F55I1VG

The 1SX250HH1F55I1VG is a powerful and versatile Embedded IC Chip that offers a unique combination of high-speed processing, flexible programmability, and robust connectivity. Its active product status and compliance with environmental regulations make it a reliable choice for modern embedded systems. With its wide range of applications and performance benefits, the 1SX250HH1F55I1VG stands out as an excellent solution for designers and engineers in the electronics industry.

FAQ

What package or case is 1SX250HH1F55I1VG available in?
1SX250HH1F55I1VG is available in the 2912-BBGA, FCBGA package / case.
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