Intel

1SX280HN3F43E2LGS3

1SX280HN3F43E2LGS3 Description

The 1SX280HN3F43E2LGS3 is a high-performance Embedded IC Chip from Intel, belonging to the Stratix® 10 SX series. This advanced FPGA is designed to deliver exceptional processing capabilities and flexibility, making it ideal for a wide range of embedded applications. With a clock speed of 1.5GHz, it ensures rapid and efficient data processing. The device operates within a temperature range of 0°C to 100°C (TJ), making it suitable for various environmental conditions. It features a dual architecture combining both MCU and FPGA functionalities, providing a versatile platform for complex system designs.

The 1SX280HN3F43E2LGS3 includes 256KB of RAM, which is sufficient for handling multiple tasks simultaneously without compromising performance. It also comes equipped with a variety of peripherals, including DMA and WDT, enhancing its functionality and reliability. The product is currently in an active status, ensuring continued support and availability. It complies with REACH regulations, confirming its safety and environmental standards.

1SX280HN3F43E2LGS3 Features

• High-Speed Processing: With a clock speed of 1.5GHz, the 1SX280HN3F43E2LGS3 delivers rapid processing capabilities, making it suitable for time-sensitive applications.
• Wide Operating Temperature Range: The device operates reliably within a temperature range of 0°C to 100°C (TJ), making it ideal for both industrial and consumer applications.
• Dual Architecture: Combining MCU and FPGA functionalities, it offers a versatile platform for complex system designs, allowing for both programmable logic and microcontroller operations.
• Robust Memory and Peripherals: Equipped with 256KB of RAM and peripherals such as DMA and WDT, it ensures efficient data handling and system reliability.
• Comprehensive Connectivity Options: The 1SX280HN3F43E2LGS3 supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into various systems.
• Packaging and Environmental Compliance: Packaged in a tray with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), it ensures safe handling and storage. Additionally, it is REACH unaffected, confirming its compliance with environmental regulations.

1SX280HN3F43E2LGS3 Applications

The 1SX280HN3F43E2LGS3 is ideal for applications requiring high-speed processing and versatile functionality. Some specific use cases include:

• Industrial Automation: Its robust performance and wide operating temperature range make it suitable for industrial control systems, where reliability and efficiency are critical.
• Embedded Systems: The combination of MCU and FPGA functionalities allows for the development of sophisticated embedded systems, such as smart sensors and IoT devices.
• Telecommunications: The comprehensive connectivity options and high-speed processing capabilities make it ideal for communication infrastructure, including base stations and network routers.
• Consumer Electronics: The device's flexibility and performance make it suitable for a variety of consumer electronics, such as smart home devices and wearable technology.

Conclusion of 1SX280HN3F43E2LGS3

The 1SX280HN3F43E2LGS3 from Intel is a powerful and versatile Embedded IC Chip that offers a unique blend of high-speed processing, robust memory, and comprehensive connectivity options. Its dual architecture and wide operating temperature range make it a standout choice for a variety of applications, from industrial automation to consumer electronics. With its active product status and compliance with environmental regulations, the 1SX280HN3F43E2LGS3 is a reliable and future-proof solution for embedded system designers.