Intel_1SX280LH3F55I1VG
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Intel
1SX280LH3F55I1VG

777-1SX280LH3F55I1VG
PDF Datasheet
IC SOC CORTEX-A53 1.5GHZ 2912BGA

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Speed
1.5GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
5A002A1
Number of I/O
1160
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1SX280LH3F55I1VG Description

1SX280LH3F55I1VG Description

The 1SX280LH3F55I1VG is a high-performance Embedded IC Chip from Intel, belonging to the Stratix® 10 SX series. This IC SOC CORTEX-A53 operates at a speed of 1.5GHz, making it suitable for demanding applications that require fast processing capabilities. The chip features a dual architecture, combining a Microcontroller Unit (MCU) with a Field-Programmable Gate Array (FPGA), which provides flexibility and adaptability for various tasks. It includes 256KB of RAM, ensuring efficient data handling and processing.

The 1SX280LH3F55I1VG is equipped with 1160 I/O ports, offering extensive connectivity options. It supports a wide range of peripherals, including DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality and reliability. The chip is compliant with RoHS standards and is REACH unaffected, ensuring it meets environmental and safety regulations. It is packaged in a tray format and has a Moisture Sensitivity Level (MSL) of 3, which allows for 168 hours of exposure before assembly.

1SX280LH3F55I1VG Features

  • High-Speed Performance: The 1.5GHz Cortex-A53 processor ensures rapid execution of complex tasks, making it ideal for high-performance applications.
  • Dual Architecture: The combination of MCU and FPGA provides a versatile platform that can handle both general-purpose computing and specialized, programmable logic tasks.
  • Robust Memory: With 256KB of RAM, the chip can efficiently manage data, supporting smooth operation even under heavy workloads.
  • Extensive Connectivity: The chip supports multiple connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for a wide range of applications.
  • Advanced Peripherals: Features like DMA and WDT enhance its functionality, ensuring reliable and efficient operation.
  • Compliance and Safety: The chip is RoHS compliant and REACH unaffected, ensuring it meets environmental and safety standards.
  • Packaging and Sensitivity: The tray packaging and MSL 3 rating ensure ease of handling and assembly, reducing the risk of moisture-related issues.

1SX280LH3F55I1VG Applications

The 1SX280LH3F55I1VG is ideal for a variety of applications due to its high performance and extensive connectivity options. Some specific use cases include:

  • Industrial Automation: The combination of high-speed processing and extensive I/O capabilities make it suitable for controlling complex machinery and systems.
  • Telecommunications: The chip's robust connectivity options, including Ethernet and USB OTG, make it ideal for networking and communication applications.
  • Automotive Systems: The dual architecture and high performance ensure it can handle the demanding tasks required in modern automotive electronics.
  • Consumer Electronics: The chip's versatility and connectivity options make it suitable for a range of consumer devices, from smart home systems to advanced multimedia devices.

Conclusion of 1SX280LH3F55I1VG

The 1SX280LH3F55I1VG is a powerful and versatile Embedded IC Chip that offers high performance and extensive connectivity options. Its dual architecture, combining MCU and FPGA, provides flexibility and adaptability, making it suitable for a wide range of applications. The chip's compliance with environmental and safety standards ensures it meets industry requirements. With its extensive I/O capabilities and advanced peripherals, the 1SX280LH3F55I1VG is an excellent choice for applications in industrial automation, telecommunications, automotive systems, and consumer electronics.

FAQ

What is 1SX280LH3F55I1VG?
1SX280LH3F55I1VG is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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