Intel_EP1K30FI256-2
original

Intel
EP1K30FI256-2

696-EP1K30FI256-2
PDF Datasheet
Loadable PLD, 0.4ns, CMOS, PBGA256, FINE LINE, BGA-256

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Tech Specifications

Package/Case
FBGA
Frequency
200MHz
Lead Free
Contains Lead
Max Frequency
80MHz
Max Operating Temperature
85°C
Max Supply Voltage
2.625V
Memory Size
24576b
Min Operating Temperature
-40°C
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EP1K30FI256-2 Description

The Intel EP1K30FI256-2 is a high-performance programmable logic device designed for a wide range of applications. This device is part of Intel's MAX 10 family, which offers a combination of general-purpose and dedicated logic resources, as well as integrated memory and digital signal processing (DSP) capabilities.

Description:

The EP1K30FI256-2 is a 28-nm Intel FPGA device with an Intel Quartus Prime integration, providing a seamless design experience. It features a high-density architecture, making it suitable for complex and demanding applications. The device comes in a flip-chip ball grid array (FBGA) package, which offers excellent electrical performance and thermal management.

Features:

  1. High-density architecture: The EP1K30FI256-2 provides a large number of programmable logic elements, allowing for the implementation of complex designs.
  2. Integrated memory: The device includes integrated block RAM (MLAB) and DSP blocks, which can be used for data storage and signal processing tasks.
  3. Digital signal processing (DSP) capabilities: The integrated DSP blocks enable high-performance, power-efficient digital signal processing applications.
  4. General-purpose and dedicated logic resources: The device offers a mix of general-purpose and dedicated logic resources, providing flexibility for various design requirements.
  5. Intel Quartus Prime integration: The EP1K30FI256-2 is designed to work seamlessly with Intel's Quartus Prime software, providing a smooth and efficient design experience.
  6. Advanced I/O capabilities: The device supports a wide range of I/O standards and protocols, making it suitable for various interface requirements.
  7. Low power consumption: The 28-nm process technology used in the EP1K30FI256-2 results in low power consumption, making it suitable for energy-efficient applications.

Applications:

The Intel EP1K30FI256-2 is suitable for a wide range of applications, including but not limited to:

  1. Communications: The device can be used in communication systems, such as base stations, routers, and switches, due to its high-speed I/O capabilities and DSP functionality.
  2. Industrial automation: The EP1K30FI256-2 can be used in industrial control systems, where its flexibility and programmability allow for the implementation of custom control algorithms.
  3. Automotive: The device can be used in various automotive applications, such as infotainment systems, advanced driver assistance systems (ADAS), and powertrain control.
  4. Consumer electronics: The EP1K30FI256-2 can be used in consumer electronics, such as smart home devices, wearables, and multimedia systems, due to its integration of memory and DSP capabilities.
  5. Aerospace and defense: The device can be used in aerospace and defense applications, where its high reliability and performance are critical.
  6. Medical electronics: The EP1K30FI256-2 can be used in medical imaging, signal processing, and monitoring systems, thanks to its low power consumption and high-performance capabilities.

In summary, the Intel EP1K30FI256-2 is a versatile and powerful FPGA device that offers a range of features and capabilities, making it suitable for various high-performance applications across different industries.

FAQ

What is the mounting type of EP1K30FI256-2?
EP1K30FI256-2 uses a Surface Mount mounting style based on the listed product specifications.
Are there related or alternative parts for EP1K30FI256-2?
What is EP1K30FI256-2?
What package or case is EP1K30FI256-2 available in?
What voltage specification is listed for EP1K30FI256-2?
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