Intel_EP2C35F672C6
original

Intel
EP2C35F672C6

696-EP2C35F672C6
PDF Datasheet
Field Programmable Gate Array, 2076 CLBs, 500MHz, 33216-Cell, CMOS, PBGA672, FBGA-672
8 Weeks

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Tech Specifications

Package/Case
FBGA
Frequency
500MHz
Lead Free
Contains Lead
Max Frequency
260MHz
Max Operating Temperature
85°C
Max Supply Voltage
1.25V
Memory Size
483840b
Min Operating Temperature
0°C
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EP2C35F672C6 Description

The Intel EP2C35F672C6 is a high-performance field programmable gate array (FPGA) belonging to the Cyclone II family. This device is designed to provide a versatile and powerful solution for various applications, including embedded systems, digital signal processing, and communications.

Description:

The EP2C35F672C6 is an FPGA that features a 672-pin flip-chip ball grid array (FCBGA) package. It is based on Intel's low-power, high-performance 90-nm process technology, which enables high-density integration and reduced power consumption.

Features:

  1. Logic Elements: The EP2C35F672C6 offers a large number of logic elements, providing ample resources for complex designs.
  2. Memory Resources: This FPGA comes with a generous amount of on-chip memory resources, including block RAM (M4K) and distributed RAM, which can be used for various purposes such as data storage, caching, and FIFOs.
  3. DSP Blocks: The device includes dedicated digital signal processing (DSP) blocks, which can be utilized for high-speed mathematical operations and signal processing tasks.
  4. High-Speed Transceivers: The EP2C35F672C6 features high-speed transceivers, supporting data rates up to 3.125 Gbps, making it suitable for high-speed communication applications.
  5. Embedded HardCopy: This FPGA can be paired with Intel's HardCopy II technology, which allows users to create a custom, hardened version of their design for improved performance and reliability.
  6. Low Power Consumption: The 90-nm process technology used in the EP2C35F672C6 enables low power consumption, making it suitable for battery-powered and energy-sensitive applications.
  7. Integrated I/O: The device offers a wide range of integrated I/O options, including LVDS, gigabit transceivers, and SERDES, providing flexibility in interfacing with various peripherals and communication protocols.

Applications:

  1. Embedded Systems: The EP2C35F672C6 is well-suited for embedded systems that require high performance, low power consumption, and flexible I/O options.
  2. Digital Signal Processing: The on-chip DSP blocks and high-speed transceivers make this FPGA an excellent choice for digital signal processing applications, such as audio and video processing, image processing, and communication systems.
  3. Communications: The high-speed transceivers and versatile I/O options make the EP2C35F672C6 suitable for various communication applications, including telecom, networking, and wireless systems.
  4. Military and Aerospace: The EP2C35F672C6 can be used in military and aerospace applications, where high reliability, performance, and ruggedness are required.
  5. Industrial Automation: The FPGA's low power consumption and flexible I/O options make it suitable for industrial automation and control systems.

In summary, the Intel EP2C35F672C6 is a powerful and versatile FPGA that offers a wide range of features and applications, making it an excellent choice for various high-performance and low-power applications.

FAQ

What is the mounting type of EP2C35F672C6?
EP2C35F672C6 uses a Surface Mount mounting style based on the listed product specifications.
What operating temperature range does EP2C35F672C6 support?
What is the standard lead time for EP2C35F672C6?
What is EP2C35F672C6?
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