Intel_EP3C25U256I7N
original

Intel
EP3C25U256I7N

696-EP3C25U256I7N
PDF Datasheet
Field Programmable Gate Array, 24624 CLBs, 472.5MHz, 24624-Cell, CMOS, PBGA256, 14 X 14 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-256
26 Weeks

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Tech Specifications

Package/Case
LFBGA
Frequency
437.5MHz
Max Frequency
315MHz
Max Operating Temperature
100°C
Max Supply Voltage
1.25V
Memory Size
608256b
Min Operating Temperature
-40°C
Min Supply Voltage
1.15V
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EP3C25U256I7N Description

The Intel EP3C25U256I7N is a high-performance, low-power FPGA (Field-Programmable Gate Array) device from Intel's Cyclone III family. This device is designed to provide a combination of high performance, low power consumption, and advanced features, making it suitable for a wide range of applications.

Description:

The EP3C25U256I7N is a mid-range FPGA device with a high-density architecture, offering up to 25,600 logic elements (LEs) and 644 digital signal processing (DSP) blocks. It features a high-speed transceiver, supporting data rates up to 6.6 Gbps, and a wide range of I/O standards, including LVCMOS, LVDS, and SSTL. The device also includes a range of memory resources, including block RAM (M4K) and distributed RAM, as well as dedicated logic elements for specific functions, such as multipliers and phase shifters.

Features:

  1. High-performance, low-power architecture: The Cyclone III family is designed to offer high performance with low power consumption, making it suitable for power-sensitive applications.
  2. High-density architecture: With up to 25,600 LEs and 644 DSP blocks, the EP3C25U256I7N provides a high level of integration and flexibility for complex designs.
  3. High-speed transceiver: The device features a high-speed transceiver supporting data rates up to 6.6 Gbps, making it suitable for high-speed communication and data transfer applications.
  4. Wide range of I/O standards: The EP3C25U256I7N supports a wide range of I/O standards, including LVCMOS, LVDS, and SSTL, providing flexibility for interfacing with various external devices.
  5. Memory resources: The device includes block RAM (M4K) and distributed RAM, as well as dedicated logic elements for specific functions, such as multipliers and phase shifters.
  6. Advanced security features: The EP3C25U256I7N includes advanced security features, such as user and device configuration access control, to protect intellectual property and ensure device integrity.

Applications:

The Intel EP3C25U256I7N is suitable for a wide range of applications, including:

  1. High-speed communication systems: The high-speed transceiver and support for various I/O standards make it suitable for high-speed communication systems, such as telecom, networking, and storage.
  2. Signal processing: The high-density architecture and DSP blocks make the EP3C25U256I7N well-suited for complex signal processing applications, such as audio, video, and image processing.
  3. Embedded systems: The low power consumption and flexibility of the Cyclone III family make it suitable for embedded systems, such as automotive, industrial control, and consumer electronics.
  4. Military and aerospace: The advanced security features and high-performance capabilities make the EP3C25U256I7N suitable for military and aerospace applications, where reliability and security are critical.
  5. Test and measurement: The device's high-speed data transfer capabilities and flexibility make it suitable for test and measurement applications, such as oscilloscopes, spectrum analyzers, and signal generators.

FAQ

What is the mounting type of EP3C25U256I7N?
EP3C25U256I7N uses a Surface Mount mounting style based on the listed product specifications.
What is EP3C25U256I7N?
What package or case is EP3C25U256I7N available in?
What operating temperature range does EP3C25U256I7N support?
What is the standard lead time for EP3C25U256I7N?
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