Microchip Technology
PM42100B-FEI

407-PM42100B-FEI
PCIE SWITCH GEN4 BBGA

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Tech Specifications

Applications
PCIe Switch
ECCN
OBSOLETE
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
1467-BBGA (40x40)
Series
-
Package / Case
1467-BBGA
Voltage - Supply
0.82V, 1.8V
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PM42100B-FEI Description

PM42100B-FEI Description

The PM42100B-FEI from Microchip Technology is a high-performance PCIe Switch designed for Gen4 Backplane applications. Packaged in a BBGA (Ball Grid Array) format, this surface-mount component supports PCI (Peripheral Component Interconnect) interfaces, enabling high-speed data transfer in complex computing environments. With a dual-voltage supply (0.82V and 1.8V), it ensures efficient power management while maintaining signal integrity. Although marked as Obsolete (ECCN: OBSOLETE), it remains ROHS3 Compliant, adhering to environmental standards. Its Moisture Sensitivity Level (MSL 4) requires careful handling within 72 hours of exposure.

PM42100B-FEI Features

  • High-Speed PCIe Gen4 Switching: Optimized for low-latency, high-bandwidth backplane communication.
  • Dual-Voltage Operation: Supports 0.82V (core) and 1.8V (I/O) for balanced power efficiency.
  • Robust Packaging: BBGA ensures reliable thermal and electrical performance in dense layouts.
  • Compliance: ROHS3 Compliant, meeting stringent environmental regulations.
  • Surface-Mount Design: Facilitates streamlined PCB integration in space-constrained applications.

PM42100B-FEI Applications

  • Data Center Backplanes: Ideal for PCIe-based server clusters requiring scalable interconnect solutions.
  • High-Performance Computing (HPC): Enables rapid data routing in GPGPU and FPGA acceleration systems.
  • Telecommunication Switches: Supports low-latency packet forwarding in 5G infrastructure.
  • Obsolete System Upgrades: Suitable for legacy PCIe Gen4 designs needing reliable, compliant components.

Conclusion of PM42100B-FEI

The PM42100B-FEI excels in specialized backplane applications, offering PCIe Gen4 switching with optimized power and signal integrity. While obsolete, its ROHS3 compliance and BBGA packaging make it a viable choice for legacy or niche high-speed systems. Engineers prioritizing low-latency routing and dual-voltage efficiency will find it particularly valuable in data center, HPC, and telecom deployments.

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