Microchip Technology

PM6104B-FEI

PM6104B-FEI Description

The PM6104B-FEI by Microchip Technology is a high-performance Surface Mount specialized backplane connector designed for 1.2T Ethernet applications, leveraging the advanced META-DX1 architecture. This ROHS3 Compliant and REACH Unaffected component is ideal for next-generation networking infrastructure, offering robust connectivity for high-speed data transmission. With an ECCN 5A991B4B classification and HTSUS 8542.31.0001 designation, it meets stringent regulatory requirements for global deployment. Packaged in a Tray and rated for Moisture Sensitivity Level (MSL) 3 (168 Hours), it ensures reliability in demanding environments.

PM6104B-FEI Features

• High-Speed Performance: Supports 1.2T Ethernet, enabling ultra-low latency and high-bandwidth backplane connectivity.
• Robust Construction: Surface Mount design ensures secure PCB integration, critical for high-vibration applications.
• Compliance & Reliability: ROHS3 Compliant, REACH Unaffected, and MSL 3 rated for extended shelf life and environmental resilience.
• Optimized for META-DX1: Tailored for Microchip’s META-DX1 architecture, ensuring seamless compatibility and performance optimization.
• Regulatory Ready: Meets ECCN 5A991B4B and HTSUS 8542.31.0001 standards for global market accessibility.

PM6104B-FEI Applications

• Data Centers: Ideal for high-density switches and routers requiring 1.2T Ethernet backplane interconnects.
• Telecommunications: Supports 5G infrastructure, enabling high-speed fronthaul and midhaul connectivity.
• Enterprise Networking: Enhances backbone performance in large-scale enterprise networks with minimal signal degradation.
• Cloud Computing: Critical for hyperscale environments demanding scalable, low-latency interconnects.

Conclusion of PM6104B-FEI

The PM6104B-FEI stands out as a cutting-edge solution for 1.2T Ethernet backplane applications, combining Microchip Technology’s expertise with industry-leading compliance and performance. Its META-DX1 optimization, Surface Mount durability, and global regulatory adherence make it a superior choice for next-gen networking infrastructure. Whether in data centers, 5G deployments, or enterprise networks, this connector delivers unmatched speed, reliability, and future-proof scalability.