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EDB4064B3PD-8D-F-D

EDB4064B3PD-8D-F-D Description

The EDB4064B3PD-8D-F-D is a high-performance memory IC chip designed by Micron Technology, Inc., a leading manufacturer in the semiconductor industry. This DRAM (Dynamic Random Access Memory) device is characterized by its 4Gbit memory size, organized as 64M x 64, making it suitable for applications requiring substantial data storage and rapid access. The memory interface is parallel, ensuring efficient data transfer rates up to 400 MHz, which is crucial for high-speed computing and data-intensive applications.

The EDB4064B3PD-8D-F-D is packaged in a 240FBGA (Fine Ball Grid Array) format, which is ideal for surface mount applications. This packaging method provides a compact footprint and enhanced thermal performance, making it suitable for modern electronic devices where space and efficiency are critical. The memory type is volatile, meaning it requires a continuous power supply to retain data, with a voltage range of 1.14V to 1.95V, ensuring compatibility with various power supply systems.

EDB4064B3PD-8D-F-D Features

• High Memory Capacity: With a 4Gbit memory size organized as 64M x 64, the EDB4064B3PD-8D-F-D offers substantial storage capabilities, making it ideal for applications that require large data sets.
• Fast Data Transfer: The parallel memory interface supports a clock frequency of 400 MHz, ensuring rapid data access and transfer rates, which are essential for high-performance computing and data-intensive applications.
• Flexible Power Supply: The voltage range of 1.14V to 1.95V provides flexibility in power supply options, making it compatible with a wide range of electronic systems.
• Surface Mount Technology: The 240FBGA package is designed for surface mount applications, offering a compact footprint and enhanced thermal performance, which is crucial for modern electronic devices.
• Moisture Sensitivity Level: With an MSL of 3 (168 hours), the EDB4064B3PD-8D-F-D is suitable for environments with varying humidity levels, ensuring reliability and durability.
• RoHS Compliance: The EDB4064B3PD-8D-F-D is ROHS3 compliant, adhering to environmental standards and ensuring the use of environmentally friendly materials.

EDB4064B3PD-8D-F-D Applications

The EDB4064B3PD-8D-F-D is well-suited for a variety of applications, including:

• High-Performance Computing: The high memory capacity and fast data transfer rates make it ideal for servers, workstations, and other computing systems that require rapid access to large data sets.
• Data Storage Systems: The substantial storage capabilities and parallel interface ensure efficient data storage and retrieval, making it suitable for RAID systems and other data storage solutions.
• Telecommunications: The compact footprint and enhanced thermal performance make it ideal for use in routers, switches, and other telecommunication equipment where space and efficiency are critical.
• Embedded Systems: The surface mount technology and flexible power supply options make it suitable for embedded systems in various industries, including automotive, industrial control, and consumer electronics.

Conclusion of EDB4064B3PD-8D-F-D

The EDB4064B3PD-8D-F-D is a high-performance DRAM memory IC chip that offers substantial storage capabilities and fast data transfer rates. Its compact 240FBGA package and surface mount technology make it suitable for modern electronic devices, while its flexible power supply options and RoHS compliance ensure compatibility and environmental responsibility. Although the product status is obsolete, the EDB4064B3PD-8D-F-D remains a reliable choice for applications requiring high-speed data access and substantial memory capacity.