Micron Technology_M29DW128F60ZA6E
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Micron Technology
M29DW128F60ZA6E

774-M29DW128F60ZA6E
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IC FLASH 128MBIT PARALLEL 64TBGA

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Tech Specifications

Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
16M x 8, 8M x 16
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
64-TBGA (10x13)
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M29DW128F60ZA6E Description

M29DW128F60ZA6E Description

The M29DW128F60ZA6E is a high-performance flash memory IC chip designed for a wide range of applications requiring reliable and efficient data storage. Manufactured by Micron Technology Inc., this memory IC chip is part of the obsolete but still highly regarded M29DW128 series. It features a 128 Mbit memory size, organized as 16M x 8 or 8M x 16, and operates with a memory parallel interface. The chip is designed for surface mount applications and comes in a 64-TBGA package, ensuring a compact and robust solution for modern electronic systems.

M29DW128F60ZA6E Features

  • Memory Size and Organization: The M29DW128F60ZA6E offers a substantial 128 Mbit memory capacity, organized flexibly as either 16M x 8 or 8M x 16. This configuration provides versatility in addressing different memory requirements and system architectures.
  • Fast Access and Write Cycle Times: an With access time of 60 ns and a write cycle time of 60 ns for both word and page operations, this memory IC ensures rapid data retrieval and storage, making it suitable for high-speed applications.
  • Voltage Range: The chip operates within a supply voltage range of 2.7V to 3.6V, providing compatibility with a variety of power supply systems and ensuring reliable performance across different operating conditions.
  • Compliance and Safety: The M29DW128F60ZA6E is REACH unaffected and RoHS3 compliant, adhering to stringent environmental and safety standards. This compliance makes it suitable for use in a wide range of industries and applications.
  • Moisture Sensitivity Level: The chip has a moisture sensitivity level (MSL) of 3, allowing for a storage period of 168 hours before assembly, which helps in maintaining the integrity of the component during manufacturing processes.
  • Packaging: The memory IC is packaged in a tray format, facilitating easy handling and integration into various electronic systems.

M29DW128F60ZA6E Applications

The M29DW128F60ZA6E is ideal for applications that demand high-speed data access and reliable storage. Its parallel memory interface and fast access times make it suitable for use in embedded systems, industrial control units, and networking equipment. The compact 64-TBGA package and surface mount design allow for integration into space-constrained environments, such as handheld devices and IoT (Internet of Things) applications.

Conclusion of M29DW128F60ZA6E

The M29DW128F60ZA6E is a robust and versatile flash memory IC chip that offers significant advantages in terms of performance and reliability. Despite being marked as obsolete, its technical specifications and compliance with industry standards make it a reliable choice for applications requiring efficient data storage and retrieval. Its fast access and write cycle times, combined with a flexible memory organization, make it an excellent solution for a variety of electronic systems. For designers and engineers seeking a high-performance memory solution, the M29DW128F60ZA6E remains a viable option, especially in legacy systems and applications where its unique features and benefits can be fully leveraged.

FAQ

What operating temperature range does M29DW128F60ZA6E support?
M29DW128F60ZA6E has an operating temperature range of -40°C ~ 85°C (TA).
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