Micron Technology_M29F200FB55M3E2
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Micron Technology
M29F200FB55M3E2

774-M29F200FB55M3E2
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IC FLASH 2MBIT PARALLEL 44SO

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Tech Specifications

Part Status Code
Obsolete
Component Density
2Mb
I/O Voltage
5.0 VOLTS
Number of Components
1
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
44-SO
Access Time
55 ns
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M29F200FB55M3E2 Description

M29F200FB55M3E2 Description

The M29F200FB55M3E2 is a high-performance Flash memory IC chip designed by Micron Technology Inc. This 2Mbit Flash memory device is organized as 256K x 8 or 128K x 16, offering versatile memory configurations to suit a variety of applications. The chip features a parallel memory interface, enabling fast data transfer rates and efficient communication with host systems. With an access time of 55 ns and a write cycle time of 55 ns for both word and page operations, the M29F200FB55M3E2 ensures rapid data read and write capabilities, making it ideal for time-sensitive operations.

The M29F200FB55M3E2 operates within a supply voltage range of 4.5V to 5.5V, providing flexibility in power supply requirements. It is available in a surface-mount package, specifically designed for compact and reliable integration into modern electronic systems. The chip is categorized under EAR99 for export control purposes and is unaffected by REACH regulations, ensuring compliance with international standards. Additionally, it is RoHS3 compliant, reflecting Micron Technology's commitment to environmental sustainability.

M29F200FB55M3E2 Features

  • Memory Organization: 256K x 8 or 128K x 16, providing flexible memory configurations.
  • Access Time: 55 ns, ensuring rapid data retrieval.
  • Write Cycle Time: 55 ns for both word and page operations, facilitating efficient data writing.
  • Memory Interface: Parallel, enabling high-speed data transfer.
  • Memory Size: 2Mbit, offering substantial storage capacity for various applications.
  • Voltage Range: 4.5V to 5.5V, providing flexibility in power supply requirements.
  • Mounting Type: Surface Mount, ensuring compact and reliable integration.
  • Compliance: REACH unaffected and RoHS3 compliant, meeting international regulatory standards.
  • Moisture Sensitivity Level: MSL 3 (168 Hours), ensuring robustness in various environmental conditions.

M29F200FB55M3E2 Applications

The M29F200FB55M3E2 is well-suited for a range of applications that require high-speed, non-volatile memory solutions. Its fast access and write times make it ideal for embedded systems, industrial control units, and telecommunications equipment. The chip's parallel interface and versatile memory configurations are particularly beneficial for applications that demand rapid data processing and storage.

Specific use cases include:

  • Embedded Systems: For storing firmware and critical system data.
  • Industrial Control: For maintaining operational parameters and control algorithms.
  • Telecommunications: For storing configuration data and temporary storage during data transmission.

Conclusion of M29F200FB55M3E2

The M29F200FB55M3E2 is a robust and efficient Flash memory IC chip that offers significant performance benefits due to its fast access and write times. Its versatile memory configurations and parallel interface make it a reliable choice for a variety of applications, particularly those requiring high-speed data processing and storage. Despite being marked as obsolete, the M29F200FB55M3E2 remains a valuable component for legacy systems and specific applications where its unique features and performance advantages are crucial.

FAQ

What is the mounting type of M29F200FB55M3E2?
M29F200FB55M3E2 uses a Surface Mount mounting style based on the listed product specifications.
What voltage specification is listed for M29F200FB55M3E2?
What operating temperature range does M29F200FB55M3E2 support?
What package or case is M29F200FB55M3E2 available in?
Are there related or alternative parts for M29F200FB55M3E2?
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