Micron Technology_MT29E3T08EUHBBM4-3:B
Micron Technology_MT29E3T08EUHBBM4-3:B
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Micron Technology
MT29E3T08EUHBBM4-3:B

774-MT29E3T08EUHBBM4-3:B
IC FLASH 3TBIT PARALLEL 333MHZ

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Tech Specifications

Clock Frequency
333 MHz
Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
384G x 8
Mounting Type
-
Memory Type
Non-Volatile
Product Status
Obsolete
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MT29E3T08EUHBBM4-3:B Description

MT29E3T08EUHBBM4-3:B Description

The MT29E3T08EUHBBM4-3:B is an advanced memory IC chip designed by Micron Technology Inc., a leading global semiconductor company. This IC features a 3Tbit FLASH memory format with a parallel memory interface, offering high-speed data transfer at a clock frequency of 333 MHz. It is packaged in a tray format, ensuring robust handling and storage. The memory organization is 384G x 8, providing substantial storage capacity for various applications.

MT29E3T08EUHBBM4-3:B Features

  • Memory Size and Organization: The MT29E3T08EUHBBM4-3:B boasts a massive 3Tbit memory size, organized as 384G x 8, making it suitable for applications requiring large data storage.
  • Clock Frequency: It operates at a clock frequency of 333 MHz, ensuring fast data read/write operations.
  • Memory Interface: The parallel memory interface allows for efficient data transfer, enhancing overall system performance.
  • Operating Temperature: With an operating temperature range of 0°C to 70°C (TA), this IC is designed for use in standard environmental conditions.
  • Voltage - Supply: It operates within a supply voltage range of 2.5V to 3.6V, providing flexibility in power supply requirements.
  • ECCN and REACH Compliance: The MT29E3T08EUHBBM4-3:B is classified under ECCN 3A991B1A and is REACH unaffected, ensuring compliance with international regulations.
  • Packaging: The tray packaging format ensures safe handling and storage, reducing the risk of damage during transportation and assembly.

MT29E3T08EUHBBM4-3:B Applications

The MT29E3T08EUHBBM4-3:B is ideal for a variety of applications that require high-capacity, high-speed memory solutions. Some specific use cases include:

  • Data Storage Systems: Ideal for large-scale data storage systems where high-density memory is required.
  • Embedded Systems: Suitable for embedded systems that need reliable and fast memory access.
  • Networking Equipment: Can be used in networking equipment where quick data retrieval and storage are critical.
  • Industrial Applications: Applicable in industrial settings where robust memory solutions are needed for data logging and control systems.

Conclusion of MT29E3T08EUHBBM4-3:B

The MT29E3T08EUHBBM4-3:B from Micron Technology Inc. is a powerful memory IC chip that offers significant advantages in terms of capacity, speed, and reliability. Its 3Tbit FLASH memory, parallel interface, and high clock frequency make it a superior choice for applications requiring large data storage and fast data transfer. Despite being marked as obsolete, its technical specifications and performance benefits continue to make it a valuable component in various electronic systems.

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MT29E3T08EUHBBM4-3:B is a Memory ICs Products from Micron Technology. This product page provides its main specifications, pricing information, availability, and inquiry options.
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