Micron Technology
MT29E3T08EUHBBM4-3:B TR

774-MT29E3T08EUHBBM4-3:B TR
IC FLASH 3TBIT PARALLEL 333MHZ

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Tech Specifications

Clock Frequency
333 MHz
Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
384G x 8
Mounting Type
-
Memory Type
Non-Volatile
Product Status
Obsolete
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MT29E3T08EUHBBM4-3:B TR Description

MT29E3T08EUHBBM4-3:B TR Description

The MT29E3T08EUHBBM4-3:B TR is an advanced memory IC chip designed by Micron Technology Inc., featuring a 3Tbit FLASH memory format with a parallel interface. This chip operates at a clock frequency of 333 MHz, ensuring high-speed data transfer and efficient performance. It is packaged in a Tape & Reel (TR) format, which is ideal for automated assembly processes. The memory organization is structured as 384G x 8, providing substantial storage capacity in a compact form factor. The operating temperature range of 0°C to 70°C (TA) makes it suitable for a variety of environmental conditions, while the supply voltage range of 2.5V to 3.6V ensures compatibility with different power supply systems. This product is REACH unaffected and ROHS3 compliant, adhering to stringent environmental and safety standards. Despite its obsolete status, the MT29E3T08EUHBBM4-3:B TR remains a robust solution for applications requiring high-density memory storage.

MT29E3T08EUHBBM4-3:B TR Features

  • High Capacity Storage: With a memory size of 3Tbit and an organization of 384G x 8, this IC chip offers significant storage capabilities, making it ideal for applications requiring large data sets.
  • Parallel Interface: The parallel memory interface ensures efficient data transfer rates, crucial for applications demanding high-speed performance.
  • Wide Operating Temperature Range: The operating temperature range of 0°C to 70°C (TA) ensures reliability and performance across various environmental conditions.
  • Flexible Voltage Range: The supply voltage range of 2.5V to 3.6V provides compatibility with a broad range of power supply systems, enhancing its versatility.
  • Compliance and Safety: The MT29E3T08EUHBBM4-3:B TR is REACH unaffected and ROHS3 compliant, ensuring it meets environmental and safety standards.
  • Moisture Sensitivity Level: With an MSL of 3 (168 Hours), the chip is designed to withstand moisture exposure during manufacturing processes, reducing the risk of damage.

MT29E3T08EUHBBM4-3:B TR Applications

The MT29E3T08EUHBBM4-3:B TR is particularly well-suited for applications that require high-density memory storage and high-speed data transfer. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems requiring large memory storage for firmware and application data.
  • Networking Equipment: Suitable for networking devices that need to store and quickly access large amounts of data.
  • Industrial Automation: Provides robust memory solutions for industrial control systems and automation applications.
  • Telecommunications: Useful in telecommunication infrastructure for storing configuration data and firmware.
  • Consumer Electronics: Can be employed in consumer electronics requiring high-speed data access and large storage capacity.

Conclusion of MT29E3T08EUHBBM4-3:B TR

The MT29E3T08EUHBBM4-3:B TR from Micron Technology Inc. is a high-performance memory IC chip that offers significant storage capacity and efficient data transfer capabilities. Its robust design, wide operating temperature range, and compliance with environmental and safety standards make it a reliable choice for a variety of applications. Despite its obsolete status, this chip remains a valuable solution for applications requiring high-density memory storage and high-speed performance.

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