Micron Technology Tariff Inquiry

MT29F128G08AUCBBH3-12:B

MT29F128G08AUCBBH3-12:B Description

The MT29F128G08AUCBBH3-12:B is a high-performance flash memory IC designed by Micron Technology. This 128Gbit flash memory device is organized as 16G x 8, offering significant storage capacity in a compact 100-ball BGA package. It features a parallel memory interface, which allows for fast data transfer rates and efficient communication with host systems. The memory operates within a supply voltage range of 2.7V to 3.6V and supports a clock frequency of 83 MHz, ensuring reliable and high-speed performance.

The MT29F128G08AUCBBH3-12:B is designed for surface mount applications, making it suitable for modern, space-constrained electronic designs. It is rated for an operating temperature range of 0°C to 70°C (TA), making it ideal for use in a variety of industrial and consumer applications. The device is packaged in trays and has a moisture sensitivity level (MSL) of 3, which allows for a 168-hour exposure time, ensuring robustness during manufacturing processes.

This product is classified under ECCN 3A991B1A and HTSUS 8542.32.0071, and it is RoHS3 compliant, adhering to stringent environmental standards. Despite its obsolete status, the MT29F128G08AUCBBH3-12:B remains a reliable choice for applications requiring high-density flash memory solutions.

MT29F128G08AUCBBH3-12:B Features

• High-Density Storage: With a memory size of 128Gbit, the MT29F128G08AUCBBH3-12:B offers substantial storage capacity, making it suitable for applications that require large amounts of data to be stored and accessed quickly.
• Parallel Interface: The parallel memory interface ensures high-speed data transfer, which is crucial for applications that demand rapid read and write operations.
• Wide Operating Voltage Range: The device operates within a voltage range of 2.7V to 3.6V, providing flexibility in power supply design and compatibility with various power sources.
• Robust Temperature Range: The operating temperature range of 0°C to 70°C (TA) ensures that the device can function reliably in a variety of environmental conditions, making it suitable for both industrial and consumer applications.
• Surface Mount Technology: The surface mount mounting type allows for efficient use of space on printed circuit boards, which is essential for modern, compact electronic designs.
• Moisture Sensitivity Level 3: With an MSL of 3, the device can withstand up to 168 hours of exposure, ensuring robustness during manufacturing processes and reducing the risk of moisture-related failures.
• RoHS3 Compliance: The MT29F128G08AUCBBH3-12:B is RoHS3 compliant, demonstrating Micron Technology's commitment to environmental responsibility and ensuring that the device meets stringent environmental standards.

MT29F128G08AUCBBH3-12:B Applications

The MT29F128G08AUCBBH3-12:B is ideal for a wide range of applications that require high-density, reliable flash memory solutions. Some specific use cases include:

• Embedded Systems: The device's high storage capacity and fast data transfer rates make it suitable for embedded systems that require large amounts of data to be stored and accessed quickly.
• Industrial Control Systems: The robust temperature range and moisture sensitivity level make the MT29F128G08AUCBBH3-12:B ideal for industrial control systems that operate in harsh environments.
• Consumer Electronics: The compact 100-ball BGA package and surface mount technology make it suitable for consumer electronics where space is at a premium.
• Networking Equipment: The high-speed parallel interface and reliable performance make the device suitable for networking equipment that requires fast data transfer and storage.

Conclusion of MT29F128G08AUCBBH3-12:B

The MT29F128G08AUCBBH3-12:B is a high-performance flash memory IC that offers significant storage capacity and fast data transfer rates. Despite its obsolete status, its robust design, wide operating voltage range, and RoHS3 compliance make it a reliable choice for applications requiring high-density flash memory solutions. The device's compact 100-ball BGA package and surface mount technology ensure efficient use of space, making it suitable for modern electronic designs. Whether used in embedded systems, industrial control systems, consumer electronics, or networking equipment, the MT29F128G08AUCBBH3-12:B provides a reliable and efficient storage solution.