Micron Technology_MT29F128G08EBCDBJ4-5M:D TR
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Micron Technology
MT29F128G08EBCDBJ4-5M:D TR

774-MT29F128G08EBCDBJ4-5M:D TR
IC FLASH 128GBIT PARALLEL 200MHZ

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Tech Specifications

Clock Frequency
200 MHz
Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
16G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
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MT29F128G08EBCDBJ4-5M:D TR Description

MT29F128G08EBCDBJ4-5M:D TR Description

The MT29F128G08EBCDBJ4-5M:D TR is a high-performance flash memory IC designed by Micron Technology Inc. This memory IC features a 128Gbit memory size, organized in a 16G x 8 configuration, and operates with a parallel memory interface. It is optimized for a clock frequency of 200 MHz, ensuring fast data transfer rates and efficient performance in various applications. The device is packaged in a surface-mount format and is available in a tape & reel (TR) package, making it suitable for automated assembly processes. The operating temperature range of 0°C to 70°C (TA) and a supply voltage range of 2.7V to 3.6V make it versatile for a wide range of operating conditions.

MT29F128G08EBCDBJ4-5M:D TR Features

  • Memory Size and Organization: The MT29F128G08EBCDBJ4-5M:D TR offers a substantial 128Gbit memory size, organized into 16G x 8, providing ample storage capacity for complex data storage needs.
  • High-Speed Performance: With a clock frequency of 200 MHz, this memory IC ensures rapid data processing and transfer, making it ideal for applications requiring high-speed memory access.
  • Parallel Memory Interface: The parallel memory interface allows for efficient data communication, enhancing overall system performance.
  • Wide Operating Temperature Range: The device operates reliably within a temperature range of 0°C to 70°C (TA), making it suitable for various environmental conditions.
  • Flexible Supply Voltage: The supply voltage range of 2.7V to 3.6V provides flexibility in power supply design, accommodating different system requirements.
  • Surface Mount Technology: The surface-mount mounting type and tape & reel (TR) packaging facilitate easy integration into modern electronic assemblies.
  • Compliance and Safety: The MT29F128G08EBCDBJ4-5M:D TR is REACH unaffected and RoHS3 compliant, ensuring it meets stringent environmental and safety standards.
  • Moisture Sensitivity Level: With an MSL of 3 (168 Hours), the device is protected against moisture, enhancing its reliability in manufacturing and storage processes.

MT29F128G08EBCDBJ4-5M:D TR Applications

The MT29F128G08EBCDBJ4-5M:D TR is well-suited for a variety of applications where high-speed, high-capacity flash memory is required. Key applications include:

  • Embedded Systems: Ideal for embedded systems that require large amounts of non-volatile memory for firmware storage and data logging.
  • Consumer Electronics: Suitable for consumer electronics such as digital cameras, media players, and smart devices that need fast and reliable memory solutions.
  • Industrial Control Systems: Provides robust memory storage for industrial control systems, ensuring data integrity and fast access times.
  • Automotive Electronics: Meets the stringent requirements of automotive electronics, where reliability and performance are critical.
  • Networking Equipment: Enhances the performance of networking equipment by providing high-speed memory for data buffering and storage.

Conclusion of MT29F128G08EBCDBJ4-5M:D TR

The MT29F128G08EBCDBJ4-5M:D TR from Micron Technology Inc. is a high-performance flash memory IC that offers significant advantages over similar models. Its large memory size, high-speed performance, and versatile operating conditions make it an ideal choice for a wide range of applications. The device’s compliance with environmental and safety standards ensures it meets the requirements of modern electronics manufacturing. Whether used in embedded systems, consumer electronics, or industrial applications, the MT29F128G08EBCDBJ4-5M:D TR delivers reliable and efficient memory solutions, making it a standout choice in the memory IC market.

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