Micron Technology Tariff Inquiry

MT29F16G08ABABAM62B3WC1

MT29F16G08ABABAM62B3WC1 Description

The MT29F16G08ABABAM62B3WC1 is a 16Gbit Flash memory IC chip designed for high-density storage applications. Manufactured by Micron Technology Inc., this device features a parallel memory interface and is organized as 2G x 8. It operates within a supply voltage range of 2.7V to 3.6V and is suitable for industrial environments with an operating temperature range of 0°C to 70°C (TA). The chip is available in a surface-mount die package, making it ideal for compact and space-efficient designs. Despite its obsolete status, the MT29F16G08ABABAM62B3WC1 remains a reliable choice for applications requiring robust and high-capacity memory solutions.

MT29F16G08ABABAM62B3WC1 Features

• Memory Size and Organization: The MT29F16G08ABABAM62B3WC1 offers a substantial 16Gbit memory size, organized as 2G x 8, providing ample storage capacity for complex systems.
• Parallel Memory Interface: This chip utilizes a parallel memory interface, enabling high-speed data transfer and efficient memory access, crucial for performance-intensive applications.
• Operating Temperature: With an operating temperature range of 0°C to 70°C (TA), the MT29F16G08ABABAM62B3WC1 is well-suited for industrial and commercial environments where temperature variations are common.
• Voltage Range: The device operates within a supply voltage range of 2.7V to 3.6V, ensuring compatibility with a variety of power supply configurations.
• Surface-Mount Die Package: The surface-mount die package allows for compact and space-efficient integration into modern electronic systems, reducing overall footprint and enhancing design flexibility.
• Moisture Sensitivity Level (MSL): The MSL rating of 3 (168 Hours) ensures the chip's reliability and durability in various environmental conditions, making it suitable for applications with varying humidity levels.
• ROHS3 Compliant: The MT29F16G08ABABAM62B3WC1 meets the stringent ROHS3 compliance standards, ensuring it is free from harmful substances and environmentally friendly.

MT29F16G08ABABAM62B3WC1 Applications

The MT29F16G08ABABAM62B3WC1 is ideal for a range of applications requiring high-density, non-volatile memory solutions. Its robust performance and compact design make it suitable for:

• Industrial Control Systems: Providing reliable storage for firmware and critical data in industrial automation and control systems.
• Embedded Systems: Enhancing the storage capacity of embedded devices, such as routers, switches, and IoT gateways.
• Consumer Electronics: Enabling high-capacity storage in devices like digital cameras, media players, and smart home appliances.
• Telecommunications: Supporting data storage and retrieval in communication infrastructure, such as base stations and network routers.

Conclusion of MT29F16G08ABABAM62B3WC1

The MT29F16G08ABABAM62B3WC1, despite its obsolete status, remains a viable and reliable option for applications requiring high-density Flash memory. Its parallel memory interface, wide operating temperature range, and compact surface-mount die package make it a versatile choice for various industrial and consumer applications. The device's compliance with ROHS3 standards and its moisture sensitivity level rating further enhance its reliability and environmental compatibility. For engineers and designers seeking a robust and high-capacity memory solution, the MT29F16G08ABABAM62B3WC1 offers a compelling combination of performance, durability, and environmental responsibility.