Micron Technology_MT29F1T08CLHBBG1-3RES:B TR
Micron Technology_MT29F1T08CLHBBG1-3RES:B TR
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Micron Technology
MT29F1T08CLHBBG1-3RES:B TR

774-MT29F1T08CLHBBG1-3RES:B TR
IC FLASH 1TBIT PARALLEL 272VBGA

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Tech Specifications

Clock Frequency
333 MHz
Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
128G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
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MT29F1T08CLHBBG1-3RES:B TR Description

MT29F1T08CLHBBG1-3RES:B TR Description

The MT29F1T08CLHBBG1-3RES:B TR is a high-performance memory IC chip designed by Micron Technology Inc., a leading manufacturer in the semiconductor industry. This device is part of the Memory IC Chips category and is specifically tailored for applications requiring robust, high-density storage solutions. The MT29F1T08CLHBBG1-3RES:B TR features a 1Tbit memory size, organized in a 128G x 8 configuration, providing ample storage capacity for demanding applications. It operates within a voltage range of 2.5V to 3.6V and supports a clock frequency of 333 MHz, ensuring fast data access and processing speeds. The memory interface is parallel, which is ideal for systems requiring direct and efficient data transfer. The device is packaged in a surface mount format, specifically in a Tape & Reel (TR) configuration, making it suitable for automated assembly processes. It is designed to operate within an ambient temperature range of 0°C to 70°C, making it suitable for a variety of environmental conditions. The MT29F1T08CLHBBG1-3RES:B TR also complies with stringent industry standards, including REACH and RoHS3, ensuring environmental sustainability and regulatory compliance.

MT29F1T08CLHBBG1-3RES:B TR Features

The MT29F1T08CLHBBG1-3RES:B TR offers several unique features that set it apart from similar memory IC chips:

  • High Memory Density: With a memory size of 1Tbit and a memory organization of 128G x 8, this device provides significant storage capacity in a compact form factor.
  • Fast Data Access: The 333 MHz clock frequency ensures rapid data retrieval and processing, making it suitable for high-speed applications.
  • Flexible Voltage Range: The device operates within a voltage range of 2.5V to 3.6V, providing flexibility in power supply requirements.
  • Parallel Memory Interface: The parallel interface allows for efficient data transfer, making it ideal for systems requiring direct memory access.
  • Surface Mount Packaging: The surface mount type and Tape & Reel (TR) packaging make it suitable for automated assembly processes, enhancing manufacturing efficiency.
  • Wide Operating Temperature Range: The device can operate within an ambient temperature range of 0°C to 70°C, making it suitable for various environmental conditions.
  • Compliance with Industry Standards: The MT29F1T08CLHBBG1-3RES:B TR is REACH Unaffected and ROHS3 Compliant, ensuring it meets environmental and regulatory requirements.
  • Moisture Sensitivity Level: With an MSL of 3 (168 Hours), the device is well-protected against moisture, ensuring reliability and longevity.

MT29F1T08CLHBBG1-3RES:B TR Applications

The MT29F1T08CLHBBG1-3RES:B TR is ideal for a wide range of applications that require high-density, high-speed memory solutions. Some specific use cases include:

  • Embedded Systems: The device's high memory density and fast data access make it suitable for embedded systems that require robust storage solutions.
  • Industrial Automation: The wide operating temperature range and moisture sensitivity level ensure reliability in harsh industrial environments.
  • Consumer Electronics: The compact form factor and surface mount packaging make it suitable for consumer electronics where space is limited.
  • Telecommunications: The high-speed data access and parallel interface are ideal for telecommunications applications requiring efficient data transfer.
  • Automotive Systems: The device's compliance with industry standards and wide operating temperature range make it suitable for automotive applications.

Conclusion of MT29F1T08CLHBBG1-3RES:B TR

The MT29F1T08CLHBBG1-3RES:B TR is a versatile and high-performance memory IC chip that offers significant advantages over similar models. Its high memory density, fast data access, and flexible voltage range make it suitable for a wide range of applications. The device's compliance with industry standards and wide operating temperature range ensure reliability and longevity. Whether used in embedded systems, industrial automation, consumer electronics, telecommunications, or automotive systems, the MT29F1T08CLHBBG1-3RES:B TR provides a robust and efficient storage solution.

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