Micron Technology_MT29F1T08EEHAFJ4-3ITF:A TR
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Micron Technology
MT29F1T08EEHAFJ4-3ITF:A TR

774-MT29F1T08EEHAFJ4-3ITF:A TR
IC FLASH 1TBIT PARALLEL 132VBGA

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Tech Specifications

Clock Frequency
333 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Parallel
Memory Organization
128G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
132-VBGA (12x18)
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MT29F1T08EEHAFJ4-3ITF:A TR Description

MT29F1T08EEHAFJ4-3ITF:A TR Description

The MT29F1T08EEHAFJ4-3ITF:A TR is a high-performance memory IC chip manufactured by Micron Technology Inc. This device is designed to offer robust and reliable storage solutions for a variety of applications. It features a 1Tbit memory size, organized in a 128G x 8 configuration, and operates with a parallel memory interface. The chip supports a clock frequency of 333 MHz, ensuring fast data transfer rates. It is packaged in a surface-mount 132-ball BGA format, making it suitable for compact and high-density designs. The MT29F1T08EEHAFJ4-3ITF:A TR operates within a voltage supply range of 2.5V to 3.6V, providing flexibility in power requirements. With a moisture sensitivity level (MSL) of 3 (168 hours), it is well-suited for environments that require protection against moisture exposure. The product is currently active and unaffected by REACH regulations, ensuring compliance with environmental standards.

MT29F1T08EEHAFJ4-3ITF:A TR Features

  • High Memory Capacity: The MT29F1T08EEHAFJ4-3ITF:A TR offers a substantial 1Tbit memory size, organized in a 128G x 8 configuration, providing ample storage for large datasets and complex applications.
  • Fast Data Transfer: With a clock frequency of 333 MHz, this memory IC chip ensures rapid data transfer, enhancing overall system performance.
  • Parallel Memory Interface: The parallel memory interface allows for efficient data communication, making it suitable for applications requiring high-speed data processing.
  • Flexible Power Supply: Operating within a voltage range of 2.5V to 3.6V, the MT29F1T08EEHAFJ4-3ITF:A TR offers flexibility in power supply requirements, accommodating a variety of power configurations.
  • Surface-Mount Packaging: The surface-mount 132-ball BGA package is ideal for compact and high-density designs, making it suitable for modern electronic systems.
  • Moisture Resistance: The moisture sensitivity level (MSL) of 3 (168 hours) ensures that the chip is protected against moisture exposure, enhancing its reliability in various environmental conditions.
  • REACH Compliance: The MT29F1T08EEHAFJ4-3ITF:A TR is unaffected by REACH regulations, ensuring compliance with environmental standards and facilitating its use in a wide range of applications.

MT29F1T08EEHAFJ4-3ITF:A TR Applications

The MT29F1T08EEHAFJ4-3ITF:A TR is ideal for applications that require high memory capacity and fast data transfer rates. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems that require large storage capacities and high-speed data processing, such as industrial control systems and smart devices.
  • Data Storage Solutions: Suitable for data storage applications where reliability and performance are critical, such as solid-state drives (SSDs) and storage arrays.
  • Telecommunications: Can be used in telecommunications equipment for storing firmware and data, ensuring fast access and reliable performance.
  • Consumer Electronics: Applicable in consumer electronics like gaming consoles, digital cameras, and multimedia devices, where high-speed data transfer and large storage capacity are essential.
  • Automotive Electronics: Ideal for automotive applications, including advanced driver-assistance systems (ADAS) and infotainment systems, where robustness and reliability are paramount.

Conclusion of MT29F1T08EEHAFJ4-3ITF:A TR

The MT29F1T08EEHAFJ4-3ITF:A TR is a versatile and high-performance memory IC chip that offers significant advantages over similar models. Its large 1Tbit memory size, fast 333 MHz clock frequency, and parallel memory interface make it suitable for a wide range of applications requiring high-speed data processing and large storage capacities. The surface-mount 132-ball BGA package ensures compatibility with modern, compact designs, while its moisture resistance and REACH compliance enhance its reliability and environmental sustainability. Whether used in embedded systems, data storage solutions, telecommunications, consumer electronics, or automotive applications, the MT29F1T08EEHAFJ4-3ITF:A TR provides a reliable and efficient storage solution that meets the demands of today's high-performance electronic systems.

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