Micron Technology

MT29F256G08CBCBBJ4-5M:B  

Memory ICs Products

MT29F256G08CBCBBJ4-5M:B Description

The MT29F256G08CBCBBJ4-5M:B is a high-performance 256Gbit FLASH memory IC chip designed by Micron Technology Inc. This device is part of the IC Memory Chips category and is housed in a 132-pin Ball Grid Array (BGA) package, making it ideal for surface mount applications. The memory organization of the MT29F256G08CBCBBJ4-5M:B is 32G x 8, providing a robust and efficient memory structure. It operates with a clock frequency of 200 MHz, ensuring fast data transfer and processing capabilities. The memory chip is designed to work within a supply voltage range of 2.7V to 3.6V and can operate within a temperature range of 0°C to 70°C (TA). The MT92F256G08CBCBBJ4-5M:B is packaged in a Tape & Reel (TR) format, facilitating easy handling and integration into automated assembly processes. This product is REACH unaffected and ROHS3 compliant, adhering to stringent environmental and safety standards. Despite its obsolete status, the MT29F256G08CBCBBJ4-5M:B remains a reliable choice for applications requiring high-density, non-volatile memory solutions.

MT29F256G08CBCBBJ4-5M:B Features

• High Memory Density: The MT29F256G08CBCBBJ4-5M:B offers a substantial 256Gbit size memory, organized as 32G x 8, making it suitable for applications requiring large storage capacities.
• Fast Data Processing: With a clock frequency of 200 MHz, this memory IC ensures rapid data transfer and processing, enhancing overall system performance.
• Flexible Voltage Range: The device operates within a supply voltage range of 2.7V to 3.6V, providing flexibility in power supply design and compatibility with various systems.
• Robust Operating Temperature Range: The MT29F256G08CBCBBJ4-5M:B can function reliably within an operating temperature range of 0°C to 70°C (TA), making it suitable for a wide range of environmental conditions.
• Surface Mount Compatibility: The 132VBGA package is designed for surface mount technology, facilitating easy integration into modern electronic assemblies.
• Environmental Compliance: The MT29F256G08CBCBBJ4-5M:B is REACH unaffected and ROHS3 compliant, ensuring it meets the latest environmental and safety standards.
• Moisture Sensitivity Level: The device has a moisture sensitivity level (MSL) of 3 (168 Hours), providing protection against moisture-related damage during manufacturing processes.

MT29F256G08CBCBBJ4-5M:B Applications

The MT29F256G08CBCBBJ4-5M:B is ideal for applications requiring high-density, non-volatile memory solutions. Its high memory density and fast data processing capabilities make it suitable for:

• Embedded Systems: Providing reliable storage for firmware and critical data in embedded devices.
• Consumer Electronics: Enhancing the storage capacity of devices such as digital cameras, media players, and smart TVs.
• Industrial Applications: Ensuring robust and reliable memory solutions in industrial control systems and automation equipment.
• Telecommunications: Supporting high-density storage requirements in networking equipment and communication devices.

Conclusion of MT29F256G08CBCBBJ4-5M:B

The MT29F256G08CBCBBJ4-5M:B is a high-performance FLASH memory IC chip that offers a combination of high memory density, fast data processing, and robust operating characteristics. Despite its obsolete status, it remains a reliable choice for applications requiring large storage capacities and fast data transfer. Its compatibility with surface mount technology and adherence to environmental standards make it a versatile and compliant solution for modern electronic systems.

MT29F256G08CBCBBJ4-5M:B Documents

Download datasheets and manufacturer documentation for MT29F256G08CBCBBJ4-5M:B

PCN Packaging :

Standard Pkg Label Chg 20/Feb/2019       Memory 24-May-2022