


Micron Technology
MT29F256G08CECEBJ4-37ITR:E
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MT29F256G08CECEBJ4-37ITR:E Description
MT29F256G08CECEBJ4-37ITR:E Description
The MT29F256G08CECEBJ4-37ITR:E is a high-performance flash memory IC chip designed by Micron Technology Inc. This device offers a substantial memory size of 256Gbit, organized in a 32G x 8 configuration, making it suitable for applications requiring large data storage capacities. The memory interface is parallel, ensuring efficient data transfer rates up to a clock frequency of 267 MHz. This IC is designed for surface mount applications and comes in a 132-pin BGA package, which is ideal for compact and high-density PCB designs.
MT29F256G08CECEBJ4-37ITR:E Features
- Memory Size and Organization: The MT29F256G08CECEBJ4-37ITR:E boasts a massive memory size of 256Gbit, organized in a 32G x 8 format. This configuration allows for efficient storage and retrieval of large datasets, making it ideal for applications that require extensive memory capacity.
- Parallel Memory Interface: The parallel memory interface ensures high-speed data transfer, with a clock frequency of up to 267 MHz. This high-speed capability is crucial for applications that demand rapid data processing and minimal latency.
- Surface Mount Technology: The surface mount mounting type allows for compact and efficient PCB designs, reducing the overall footprint and improving the thermal performance of the device.
- Voltage Range: The device operates within a voltage range of 2.7V to 3.6V, providing flexibility in power supply requirements and ensuring compatibility with a wide range of systems.
- Compliance and Safety: The MT29F256G08CECEBJ4-37ITR:E is REACH unaffected and ROHS3 compliant, ensuring that it meets the highest environmental and safety standards. This compliance is essential for manufacturers looking to adhere to global regulations and reduce environmental impact.
- Moisture Sensitivity Level: With a moisture sensitivity level (MSL) of 3 (168 hours), the device is well-suited for environments with varying humidity levels, ensuring long-term reliability and performance.
MT29F256G08CECEBJ4-37ITR:E Applications
The MT29F256G08CECEBJ4-37ITR:E is ideal for a variety of applications that require high-density memory solutions. Some specific use cases include:
- Embedded Systems: The large memory capacity and high-speed data transfer capabilities make this IC suitable for embedded systems that require extensive data storage and processing, such as advanced IoT devices and industrial control systems.
- Networking Equipment: The device's high performance and reliability are well-suited for networking applications, including routers, switches, and other network infrastructure components that require robust memory solutions.
- Consumer Electronics: The compact design and high memory capacity make the MT29F256G08CECEBJ4-37ITR:E ideal for consumer electronics, such as smart TVs, gaming consoles, and high-end smartphones, where large storage and fast data access are critical.
- Automotive Systems: The device's robustness and compliance with environmental standards make it suitable for automotive applications, including advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.
Conclusion of MT29F256G08CECEBJ4-37ITR:E
The MT29F256G08CECEBJ4-37ITR:E is a powerful and versatile flash memory IC chip that offers significant advantages over similar models. Its large memory size, high-speed parallel interface, and surface mount technology make it an excellent choice for applications requiring high-density memory solutions. The device's compliance with environmental and safety standards ensures its suitability for a wide range of industries and applications. While the product status is "Not For New Designs," the MT29F256G08CECEBJ4-37ITR:E remains a reliable and high-performance option for existing designs and systems that require robust memory capabilities.



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