Micron Technology_MT29F256G08CKCDBJ5-6R:D
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Micron Technology
MT29F256G08CKCDBJ5-6R:D

774-MT29F256G08CKCDBJ5-6R:D
IC FLASH 256GBIT PAR 132TBGA

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Tech Specifications

Clock Frequency
167 MHz
Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
32G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
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MT29F256G08CKCDBJ5-6R:D Description

MT29F256G08CKCDBJ5-6R:D Description

The MT29F256G08CKCDBJ5-6R:D is a high-performance, 256Gbit Flash memory IC from Micron Technology Inc., designed for demanding applications requiring large storage capacities and fast data access. This device features a parallel memory interface, enabling efficient data transfer and high-speed operation at a clock frequency of 167 MHz. It is housed in a 132-ball BGA package, which is ideal for surface-mount applications, ensuring robustness and reliability in various electronic systems.

MT29F256G08CKCDBJ5-6R:D Features

  • Memory Size and Organization: The MT29F256G08CKCDBJ5-6R:D offers a substantial memory size of 256Gbit, organized as 32G x 8, providing ample storage for complex data sets and applications.
  • Clock Frequency: Operating at a clock frequency of 167 MHz, this Flash memory IC ensures rapid data processing and retrieval, making it suitable for high-speed applications.
  • Voltage and Temperature Range: The device operates within a supply voltage range of 2.7V to 3.6V and an operating temperature range of 0°C to 70°C (TA), making it versatile for a variety of environments.
  • Mounting Type: The surface-mount technology (SMT) ensures ease of integration into modern electronic designs, enhancing both performance and reliability.
  • Moisture Sensitivity Level (MSL): With an MSL of 3 (168 hours), the MT29F256G08CKCDBJ5-6R:D is well-suited for applications requiring protection against moisture, ensuring long-term stability.
  • Regulatory Compliance: The device is ROHS3 compliant, adhering to stringent environmental standards and ensuring compatibility with modern manufacturing processes.
  • Packaging: Supplied in a tray package, the MT29F256G08CKCDBJ5-6R:D is designed for efficient handling and storage during manufacturing and assembly processes.

MT29F256G08CKCDBJ5-6R:D Applications

The MT29F256G08CKCDBJ5-6R:D is ideal for a range of applications where high-density storage and fast data access are critical. Its large memory size and high-speed operation make it suitable for:

  • Embedded Systems: Providing robust storage solutions for embedded devices requiring large data storage and fast access times.
  • Industrial Applications: Ensuring reliable data storage and retrieval in industrial environments where temperature and moisture resistance are essential.
  • Consumer Electronics: Enhancing the performance of consumer devices by offering high-speed data processing and large storage capacities.
  • Networking Equipment: Supporting high-speed data transfer and storage requirements in networking applications, such as routers and switches.

Conclusion of MT29F256G08CKCDBJ5-6R:D

The MT29F256G08CKCDBJ5-6R:D from Micron Technology Inc. stands out as a high-performance Flash memory IC, offering significant advantages over similar models. Its large memory size, high clock frequency, and robust packaging make it an ideal choice for applications requiring fast data access and large storage capacities. Despite being marked as obsolete, the MT29F256G08CKCDBJ5-6R:D remains a reliable and efficient solution for various electronic systems, ensuring compatibility and performance in diverse environments.

FAQ

What is MT29F256G08CKCDBJ5-6R:D?
MT29F256G08CKCDBJ5-6R:D is a Memory ICs Products from Micron Technology. This product page provides its main specifications, pricing information, availability, and inquiry options.
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