Micron Technology_MT29F2G01ABAGDM79A3WC1L
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Micron Technology
MT29F2G01ABAGDM79A3WC1L

774-MT29F2G01ABAGDM79A3WC1L
IC FLASH 2GBIT SPI DIE
2 Weeks

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Tech Specifications

Part Status Code
Production
I/O Voltage
3.3 VOLTS
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
Die
Package / Case
Die
Technology
FLASH - NAND
Capacity
2Gb
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MT29F2G01ABAGDM79A3WC1L Description

MT29F2G01ABAGDM79A3WC1L Description

The MT29F2G01ABAGDM79A3WC1L is a high-performance, 2Gbit Flash memory IC chip designed by Micron Technology Inc. This device is part of the broader MT29F2G01 family and is optimized for applications requiring robust, non-volatile storage solutions. The chip features a SPI (Serial Peripheral Interface) memory interface, which is widely used in embedded systems for its simplicity and efficiency. The memory organization is 2G x 1, providing a total memory size of 2Gbit, making it suitable for applications that demand significant storage capacity in a compact form factor.

The MT29F2G01ABAGDM79A3WC1L is designed for surface mount technology (SMT), ensuring reliable and space-efficient integration into modern electronic devices. The device is available in a die package, which is ideal for high-density applications and offers flexibility for various packaging requirements. The voltage supply range of 2.7V to 3.6V ensures compatibility with a wide range of power sources, enhancing its versatility.

This product is REACH unaffected and RoHS3 compliant, adhering to stringent environmental and safety standards. The moisture sensitivity level (MSL) is rated at 3 (168 hours), making it suitable for various manufacturing environments and ensuring long-term reliability.

MT29F2G01ABAGDM79A3WC1L Features

  • High Memory Capacity: The 2Gbit memory size provides substantial storage capacity, ideal for applications requiring large data storage.
  • SPI Interface: The SPI memory interface ensures efficient data transfer and compatibility with a wide range of microcontrollers and processors.
  • Surface Mount Technology: The surface mount mounting type allows for compact and reliable integration into modern electronic devices.
  • Flexible Packaging: Available in a die package, offering flexibility for various packaging requirements and high-density applications.
  • Wide Voltage Range: The 2.7V to 3.6V supply voltage range ensures compatibility with a variety of power sources, enhancing its versatility.
  • Environmental Compliance: REACH unaffected and RoHS3 compliant, ensuring adherence to environmental and safety standards.
  • Moisture Sensitivity Level: MSL 3 (168 hours) ensures reliability in various manufacturing environments.

MT29F2G01ABAGDM79A3WC1L Applications

The MT29F2G01ABAGDM79A3WC1L is ideal for a variety of applications that require high-density, non-volatile memory solutions. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems where compact size and high storage capacity are critical.
  • Consumer Electronics: Suitable for consumer electronics that require reliable and efficient memory solutions.
  • Industrial Applications: Applicable in industrial settings where robustness and environmental compliance are essential.
  • IoT Devices: Perfect for IoT devices that need to store significant amounts of data in a small form factor.

Conclusion of MT29F2G01ABAGDM79A3WC1L

The MT29F2G01ABAGDM79A3WC1L is a versatile and high-performance Flash memory IC chip that offers significant storage capacity in a compact form factor. Its SPI interface and surface mount technology make it suitable for a wide range of applications, from embedded systems to consumer electronics. The device's environmental compliance and moisture sensitivity level ensure reliability and compatibility with modern manufacturing processes. Overall, the MT29F2G01ABAGDM79A3WC1L is an excellent choice for applications requiring robust, non-volatile memory solutions.

FAQ

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Yes. Related or alternative parts may be available on this page when relevant product data is provided.
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