Micron Technology_MT29F2G08ABAGAM79A3WC1
Micron Technology_MT29F2G08ABAGAM79A3WC1
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Micron Technology
MT29F2G08ABAGAM79A3WC1

774-MT29F2G08ABAGAM79A3WC1
IC FLASH 2GBIT PARALLEL DIE

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Tech Specifications

Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
256M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
Die
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MT29F2G08ABAGAM79A3WC1 Description

MT29F2G08ABAGAM79A3WC1 Description

The MT29F2G08ABAGAM79A3WC1 is a high-performance flash memory IC chip manufactured by Micron Technology Inc. This device offers a memory size of 2Gbit, organized in a 256M x 8 configuration, making it suitable for applications requiring significant storage capacity in a compact form factor. The memory interface is parallel, ensuring fast data transfer rates and efficient communication with host systems. This chip is designed for surface mount applications, which is ideal for modern electronics where space and reliability are critical factors.

MT29F2G08ABAGAM79A3WC1 Features

  • Memory Size and Organization: The MT29F2G08ABAGAM79A3WC1 features a 2Gbit memory size, organized as 256M x 8, providing ample storage for complex data storage needs.
  • Operating Temperature: It operates within a temperature range of 0°C to 70°C (TA), making it suitable for a wide range of environmental conditions.
  • Voltage Supply: The chip operates on a voltage supply of 2.7V to 3.6V, ensuring compatibility with various power supply systems.
  • Memory Interface: The parallel memory interface ensures high-speed data transfer, crucial for applications requiring rapid access to stored data.
  • Package Type: The die package is designed for surface mount technology (SMT), offering a compact and reliable solution for modern electronic devices.
  • Compliance and Status: The MT29F2G08ABAGAM79A3WC1 is REACH unaffected and RoHS3 compliant, ensuring it meets the latest environmental and safety standards. However, it is important to note that this product is now obsolete, which may affect its availability and support.
  • Manufacturer and Category: Manufactured by Micron Technology Inc., a leading provider of memory solutions, this chip falls under the category of Memory IC Chips.

MT29F2G08ABAGAM79A3WC1 Applications

The MT29F2G08ABAGAM79A3WC1 is ideal for a variety of applications where high-density, non-volatile storage is required. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems that require reliable, high-capacity storage for firmware and data.
  • Consumer Electronics: Suitable for consumer electronics such as digital cameras, media players, and smart devices where compact size and high performance are essential.
  • Industrial Applications: Can be used in industrial control systems and IoT devices where robustness and reliability are critical.
  • Telecommunications: Useful in telecom equipment for storing configuration data and firmware updates.

Conclusion of MT29F2G08ABAGAM79A3WC1

The MT29F2G08ABAGAM79A3WC1 is a versatile and high-performance flash memory IC chip that offers significant storage capacity in a compact die package. Its parallel memory interface ensures fast data transfer, making it suitable for applications where speed and reliability are paramount. Despite being marked as obsolete, the MT29F2G08ABAGAM79A3WC1 remains a reliable choice for designers and engineers looking for a proven memory solution. Its compliance with environmental and safety standards further enhances its appeal. For those seeking a robust and compact memory solution, the MT29F2G08ABAGAM79A3WC1 is a strong contender, though potential buyers should consider its availability and support status.

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