Micron Technology_MT29F2T08EELCHD4-M:C TR
Micron Technology_MT29F2T08EELCHD4-M:C TR
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Micron Technology
MT29F2T08EELCHD4-M:C TR

774-MT29F2T08EELCHD4-M:C TR
TLC 2T 256GX8 FBGA DDP

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Tech Specifications

Series
-
REACH Status
REACH Unaffected
Mfr
Micron Technology Inc.
Package
Tape & Reel (TR)
Product Status
Active
RoHS
RoHS Compliant

MT29F2T08EELCHD4-M:C TR Description

MT29F2T08EELCHD4-M:C TR Description

The MT29F2T08EELCHD4-M:C TR is a high-performance TLC (Triple-Level Cell) 2T 256GX8 Flash Memory IC Chip, designed and manufactured by Micron Technology Inc. This memory chip is packaged in a Tape & Reel (TR) format, making it ideal for automated assembly processes. The device is currently in an active product status, ensuring its availability and reliability for various applications. The REACH status of this product is unaffected, indicating compliance with stringent environmental and safety regulations. While its DigiKey programmability has not been verified, it remains a robust option for memory solutions.

MT29F2T08EELCHD4-M:C TR Features

The MT29F2T08EELCHD4-M:C TR offers several unique features that set it apart from similar memory IC chips:

  • High Capacity Storage: With a capacity of 256GB, this TLC 2T memory chip provides substantial storage capabilities, making it suitable for applications requiring large data storage.
  • Advanced TLC Technology: Utilizing Triple-Level Cell technology, this chip can store three bits of data per cell, enhancing storage density and efficiency.
  • 2T Architecture: The 2T architecture ensures high-speed data transfer and improved performance, making it ideal for demanding applications.
  • FBGA Packaging: The Fine Ball Grid Array (FBGA) packaging offers a compact footprint and excellent thermal performance, suitable for space-constrained designs.
  • DDP: Support Dual Die Package (DDP) support allows for increased storage capacity in a single package, optimizing board space utilization.
  • Tape & Reel Packaging: This packaging format is ideal for automated assembly lines, ensuring efficient and error-free production processes.

MT29F2T08EELCHD4-M:C TR Applications

The MT29F2T08EELCHD4-M:C TR is versatile and finds applications across various industries:

  • Consumer Electronics: Ideal for high-capacity storage needs in devices such as smartphones, tablets, and digital cameras.
  • Industrial Applications: Suitable for embedded systems requiring robust and reliable memory solutions, such as industrial controllers and IoT devices.
  • Automotive: Provides the necessary storage for advanced driver-assistance systems (ADAS) and infotainment systems in modern vehicles.
  • Data Centers: Can be used in solid-state drives (SSDs) for data centers, offering high-speed data access and large storage capacities.
  • Medical Devices: Ensures reliable data storage for medical imaging and diagnostic equipment, where data integrity is critical.

Conclusion of MT29F2T08EELCHD4-M:C TR

The MT29F2T08EELCHD4-M:C TR from Micron Technology Inc. is a high-capacity, high-performance TLC 2T 256GX8 Flash Memory IC Chip that offers significant advantages over similar models. Its advanced TLC technology, 2T architecture, and DDP support make it a superior choice for applications requiring large storage capacities and high-speed data transfer. The FBGA packaging and tape & reel format ensure it is suitable for modern, space-efficient designs and automated assembly processes. Whether used in consumer electronics, industrial systems, automotive applications, data centers, or medical devices, the MT29F2T08EELCHD4-M:C TR provides reliable and efficient memory solutions, making it an essential component for a wide range of industries.

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What is MT29F2T08EELCHD4-M:C TR?
MT29F2T08EELCHD4-M:C TR is a Memory ICs Products from Micron Technology. This product page provides its main specifications, pricing information, availability, and inquiry options.
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