Micron Technology_MT29F2T08EELCHL4-M:C
Micron Technology_MT29F2T08EELCHL4-M:C
original

Micron Technology
MT29F2T08EELCHL4-M:C

774-MT29F2T08EELCHL4-M:C
TLC 2T 256GX8 FBGA
26 Weeks

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Tech Specifications

Series
-
Mfr
Micron Technology Inc.
Package
Tray
Product Status
Active
USHTS
8542320051
FBGA Marking Code
NY219

MT29F2T08EELCHL4-M:C Description

MT29F2T08EELCHL4-M:C Description

The MT29F2T08EELCHL4-M:C is a high-performance TLC (Triple-Level Cell) 2T 256GX8 Flash Memory IC Chip manufactured by Micron Technology Inc. This memory chip is designed to offer substantial storage capacity in a compact form factor, making it ideal for a wide range of applications that require high-density storage solutions. The device is packaged in a FBGA (Fine Ball Grid Array) format, which ensures excellent thermal performance and mechanical stability. The product is currently in an active status, indicating its reliability and suitability for ongoing projects and new designs.

MT29F2T08EELCHL4-M:C Features

  • High Storage Capacity: The MT29F2T08EELCHL4-M:C provides a substantial 256GB of storage capacity, making it one of the highest-density TLC flash memory devices available. This capacity is particularly beneficial for applications that require large amounts of data storage within a small footprint.
  • TLC Technology: Utilizing Triple-Level Cell technology, this memory chip can store three bits of data per cell, significantly increasing the storage density compared to traditional SLC (Single-Level Cell) or MLC (Multi-Level Cell) flash memory. This results in a more cost-effective solution without compromising on performance.
  • 2T Architecture: The 2T (2-Transistor) architecture enhances the reliability and endurance of the memory chip, making it suitable for demanding applications that require frequent read/write cycles.
  • FBGA Packaging: The Fine Ball Grid Array packaging ensures excellent thermal performance and mechanical stability, making it ideal for use in various environmental conditions. This packaging also allows for efficient integration into modern electronic systems.
  • Active Product Status: As an active product from Micron Technology, the2 MT9F2T08EELCHL4-M:C benefits from ongoing support and updates, ensuring its compatibility with future technologies and applications.

MT29F2T08EELCHL4-M:C Applications

The MT29F2T08EELCHL4-M:C is suitable for a wide range of applications due to its high storage capacity, advanced TLC technology, and robust packaging. Key applications include:

  • Consumer Electronics: Ideal for devices such as smartphones, tablets, and digital cameras where high-density storage is required in a compact form factor.
  • Industrial Systems: Suitable for industrial applications that require reliable and high-capacity storage solutions, such as embedded systems, IoT devices, and industrial control systems.
  • Automotive Electronics: The robustness and reliability of the MT29F2T08EELCHL4-M:C make it suitable for automotive applications, including infotainment systems, advanced driver assistance systems (ADAS), and telematics.
  • Data Storage Devices: Can be used in solid-state drives (SSDs) and other data storage devices that require high-density flash memory to store large amounts of data efficiently.

Conclusion of MT29F2T08EELCHL4-M:C

The MT292FT08EELCHL4-M:C from Micron Technology Inc. is a cutting-edge TLC 2T 256GX8 Flash Memory IC Chip that offers significant advantages over similar models. Its high storage capacity, advanced TLC technology, and robust FBGA packaging make it an ideal choice for a wide range of applications, from consumer electronics to industrial and automotive systems. With its active product status, the MT29F2T08EELCHL4-M:C ensures ongoing support and compatibility with future technologies, making it a reliable and future-proof solution for high-density storage needs.

FAQ

What package or case is MT29F2T08EELCHL4-M:C available in?
MT29F2T08EELCHL4-M:C is available in the Tray package / case.
What is MT29F2T08EELCHL4-M:C?
Is MT29F2T08EELCHL4-M:C currently in stock?
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