Micron Technology_MT29F32G08CBADAWP:D TR
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Micron Technology
MT29F32G08CBADAWP:D TR

774-MT29F32G08CBADAWP:D TR
IC FLASH 32GBIT PAR 48TSOP I

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Tech Specifications

Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
4G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
48-TSOP I
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MT29F32G08CBADAWP:D TR Description

MT29F32G08CBADAWP:D TR Description

The MT29F32G08CBADAWP:D TR is a high-performance memory IC chip designed by Micron Technology Inc., a leading provider of advanced semiconductor solutions. This chip is part of the Memory IC Chips category and offers a robust combination of features suitable for various electronic applications. The MT29F32G08CBADAWP:D TR is packaged in a Tape & Reel (TR) format, ensuring ease of handling and integration into surface-mount manufacturing processes. It features a 32Gbit memory size organized in a 4G x 8 configuration, providing substantial storage capacity in a compact form factor.

MT29F32G08CBADAWP:D TR Features

  • Memory Format: FLASH, ensuring fast read and write speeds, making it ideal for applications requiring quick data access and storage.
  • Memory Interface: Parallel, allowing for efficient data transfer and compatibility with a wide range of systems.
  • Operating Temperature: 0°C to 70°C (TA), ensuring reliable performance across a broad temperature range suitable for industrial and consumer applications.
  • Voltage - Supply: 2.7V to 3.6V, providing flexibility in power supply requirements and ensuring compatibility with various power sources.
  • Moisture Sensitivity Level (MSL): Level 3 (168 Hours), making it suitable for manufacturing environments with controlled humidity levels.
  • Regulatory Compliance: ROHS3 Compliant and REACH Unaffected, ensuring environmental safety and compliance with international standards.
  • Mounting Type: Surface Mount, facilitating integration into modern PCB designs and enabling compact system builds.
  • Memory Organization: 4G x 8, offering a balanced memory structure that optimizes performance and capacity.
  • ECCN: 3A991B1A, indicating compliance with export regulations and facilitating international trade.

MT29F32G08CBADAWP:D TR Applications

The MT29F32G08CBADAWP:D TR is ideal for a variety of applications where high-density, non-volatile storage is required. Its FLASH memory format and parallel interface make it particularly suitable for embedded systems, industrial control units, and consumer electronics. The chip's operating temperature range and moisture sensitivity level ensure it can be used in both indoor and outdoor environments, making it versatile for applications such as:

  • Embedded Systems: Providing reliable storage for firmware and critical data in devices like routers, modems, and smart meters.
  • Industrial Control: Storing configuration data and operational parameters in industrial automation systems and PLCs.
  • Consumer Electronics: Enhancing the storage capacity of devices like digital cameras, media players, and gaming consoles.

Conclusion of MT29F32G08CBADAWP:D TR

The MT29F32G08CBADAWP:D TR from Micron Technology Inc. stands out for its high-density FLASH memory, robust performance, and compatibility with various electronic systems. Its parallel memory interface and wide operating temperature range make it a reliable choice for applications requiring non-volatile storage. Despite being marked as obsolete, the MT29F32G08CBADAWP:D TR remains a viable option for legacy systems and applications where its specific features and performance benefits are required. Its compliance with environmental regulations and export controls further enhances its appeal for global deployment.

FAQ

What operating temperature range does MT29F32G08CBADAWP:D TR support?
MT29F32G08CBADAWP:D TR has an operating temperature range of 0°C ~ 70°C (TA).
What is MT29F32G08CBADAWP:D TR?
What package or case is MT29F32G08CBADAWP:D TR available in?
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