Micron Technology_MT29F3T08EQCBBG2-37:B TR
Micron Technology_MT29F3T08EQCBBG2-37:B TR
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Micron Technology
MT29F3T08EQCBBG2-37:B TR

774-MT29F3T08EQCBBG2-37:B TR
IC FLASH 3TBIT PAR 272TBGA

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Tech Specifications

Clock Frequency
267 MHz
Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
384G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
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MT29F3T08EQCBBG2-37:B TR Description

MT29F3T08EQCBBG2-37:B TR Description

The MT29F3T08EQCBBG2-37:B TR is a high-performance memory IC chip designed by Micron Technology Inc., a leading manufacturer in the semiconductor industry. This IC is part of the Memory IC Chips category and is specifically designed for applications requiring large storage capacities and fast data access. The MT29F3T08EQCBBG2-37:B TR features a 3Tbit memory size, organized in a 384G x 8 configuration, and utilizes a parallel memory interface for efficient data transfer. The device operates within a voltage range of 2.7V to 3.6V and supports a clock frequency of 267 MHz, ensuring high-speed performance. It is packaged in a Tape & Reel (TR) format, making it suitable for surface mount applications. The operating temperature range is 0°C to 70°C (TA), and it has a moisture sensitivity level (MSL) of 3 (168 Hours), ensuring reliability in various environmental conditions. The MT29F3T08EQCBBG2-37:B TR is REACH unaffected and ROHS3 compliant, adhering to stringent environmental and safety standards.

MT29F3T08EQCBBG2-37:B TR Features

  • High Memory Capacity: The MT29F3T08EQCBBG2-37:B TR offers a substantial 3Tbit memory size, organized in a 384G x 8 configuration, making it ideal for applications requiring large data storage.
  • Fast Data Access: With a clock frequency of 267 MHz, this IC ensures rapid data access and transfer, enhancing overall system performance.
  • Flexible Voltage Range: The device operates within a voltage range of 2.7V to 3.6V, providing flexibility in power supply requirements.
  • Parallel Memory Interface: The parallel memory interface allows for efficient data transfer, making it suitable for high-speed applications.
  • Surface Mount Compatibility: Packaged in a Tape & Reel (TR) format, this IC is designed for surface mount applications, facilitating easy integration into modern electronic systems.
  • Wide Operating Temperature Range: The MT29F3T08EQCBBG2-37:B TR operates reliably within a temperature range of 0°C to 70°C (TA), making it suitable for use in various environmental conditions.
  • Moisture Sensitivity Level: With an MSL of 3 (168 Hours), this IC is designed to withstand exposure to moisture, ensuring long-term reliability.
  • Environmental Compliance: The MT29F3T08EQCBBG2-37:B TR is REACH unaffected and ROHS3 compliant, meeting the highest environmental and safety standards.

MT29F3T08EQCBBG2-37:B TR Applications

The MT29F3T08EQCBBG2-37:B TR is well-suited for a variety of applications that demand high memory capacity and fast data access. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems requiring large storage capacities and high-speed data processing.
  • Data Storage Devices: Suitable for use in data storage devices where high memory density and fast access times are critical.
  • Industrial Applications: The wide operating temperature range and moisture sensitivity level make it suitable for industrial applications with varying environmental conditions.
  • Consumer Electronics: Applicable in consumer electronics where high memory capacity and fast data access are essential for performance.

Conclusion of MT29F3T08EQCBBG2-37:B TR

The MT29F3T08EQCBBG2-37:B TR is a versatile and high-performance memory IC chip designed to meet the demands of modern electronic systems. Its large memory capacity, fast data access, and compatibility with surface mount applications make it an ideal choice for a wide range of applications. The device's wide operating temperature range, moisture sensitivity level, and environmental compliance further enhance its reliability and suitability for various environments. Whether for embedded systems, data storage devices, industrial applications, or consumer electronics, the MT29F3T08EQCBBG2-37:B TR offers a robust and efficient solution for high-density memory storage and fast data processing.

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