Micron Technology_MT29F4G08ABADAH4-E:D
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Micron Technology
MT29F4G08ABADAH4-E:D

774-MT29F4G08ABADAH4-E:D
IC FLASH 4GBIT PARALLEL 63VFBGA

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Tech Specifications

Program Current (mA)
35
PPAP
No
Operating Current (mA)
35
Memory Type
Non-Volatile
Product Status
Obsolete
Automotive
No
Supplier Package
VFBGA
Chip Density (bit)
4G
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MT29F4G08ABADAH4-E:D Description

MT29F4G08ABADAH4-E:D Description

The MT29F4G08ABADAH4-E:D is a 4Gbit Flash memory IC designed for high-performance applications requiring significant storage capacity in a compact form factor. Manufactured by Micron Technology, this device is part of the Memory ICs Products category and is housed in a 63-ball FBGA package. The memory organization is 512M x 8, providing a robust and efficient storage solution. The memory interface is parallel, ensuring compatibility with a wide range of systems and applications.

MT29F4G08ABADAH4-E:D Features

  • Memory Size and Organization: The MT29F4G08ABADAH4-E:D offers a substantial 4Gbit memory size, organized as 512M x 8, making it ideal for applications that require large data storage and fast access.
    times- Operating Temperature: The device operates within a temperature range of 0°C to 70°C (TA), ensuring reliable performance in various environmental conditions.
  • Voltage Supply: The memory IC operates within a voltage range of 2.7V to 3.6V, providing flexibility in power supply requirements.
  • Mounting Type: Surface mount technology (SMT) is utilized, allowing for efficient integration into compact and high-density designs.
  • Memory Interface: The parallel memory interface ensures compatibility with a wide range of systems, facilitating easy integration and high-speed data transfer.
  • Package Type: The6 3-ball FBGA package offers a compact and robust solution, suitable for space-constrained applications.
  • Moisture Sensitivity Level (MSL): MSL 3 (168 Hours) ensures the device is well-protected against moisture, enhancing reliability in various environments.
  • RoHS Compliance: The MT29F4G08ABADAH4-E:D is ROHS3 compliant, meeting environmental standards and ensuring the use of environmentally friendly materials.
  • Product Status: Although the product is marked as obsolete, it remains a viable option for legacy systems and specific applications where its unique features are required.

MT2F94G08ABADAH4-E:D Applications

The MT29F4G08ABADAH4-E:D is well-suited for a variety of applications, including:

  • Embedded Systems: Ideal for embedded systems requiring high-density storage and fast data access, such as industrial control systems, medical devices, and automotive electronics.
  • Consumer Electronics: Suitable for consumer electronics where compact size and high performance are critical, such as digital cameras, gaming consoles, and smart TVs.
  • Networking and Telecommunications: Provides reliable storage for networking equipment and telecommunications devices, ensuring efficient data handling and storage.
  • Industrial Automation: Enhances the performance of industrial automation systems by providing robust and high-capacity storage solutions.

Conclusion of MT29F4G08ABADAH4-E:D

The MT29F4G08ABADAH4-E:D Flash memory IC from Micron Technology offers a high-density storage solution with a parallel interface, making it suitable for a wide range of applications. Its compact 63-ball FBGA package, surface mount technology, and wide operating temperature range ensure it can be integrated into various systems with ease. While marked as obsolete, the MT29F4G08ABADAH4-E:D remains a valuable option for specific applications where its unique features and performance benefits are required.

FAQ

What package or case is MT29F4G08ABADAH4-E:D available in?
MT29F4G08ABADAH4-E:D is available in the 63-VFBGA package / case.
What is MT29F4G08ABADAH4-E:D?
What operating temperature range does MT29F4G08ABADAH4-E:D support?
Are there related or alternative parts for MT29F4G08ABADAH4-E:D?
What is the mounting type of MT29F4G08ABADAH4-E:D?
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