Micron Technology_MT29F4G08ABAFAM70A3WC1
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Micron Technology
MT29F4G08ABAFAM70A3WC1

774-MT29F4G08ABAFAM70A3WC1
IC FLASH 4GBIT PARALLEL DIE
20 weeks

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Tech Specifications

Part Status Code
Production
HTS
COMPONENTS
I/O Voltage
3.3 VOLTS
PPAP
No
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
Die
Automotive
No
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MT29F4G08ABAFAM70A3WC1 Description

MT29F4G08ABAFAM70A3WC1 Description

The MT29F4G08ABAFAM70A3WC1 is a high-performance, 4Gbit Flash memory IC designed by Micron Technology Inc. This device features a parallel memory interface and is organized as 512M x 8, making it suitable for applications requiring large storage capacities and high-speed data access. The MT29F4G08ABAFAM70A3WC1 is packaged as a die, which is ideal for surface mount applications and ensures a compact footprint on the PCB. It operates within a supply voltage range of 2.7V to 3.6V, providing flexibility in power supply design. This memory IC is REACH unaffected and ROHS3 compliant, ensuring it meets the latest environmental and safety standards. With a moisture sensitivity level (MSL) of 3 (168 hours), it is well-suited for various manufacturing processes.

MT29F4G08ABAFAM70A3WC1 Features

  • Memory Size and Organization: The MT29F4G08ABAFAM70A3WC1 offers a substantial 4Gbit memory size, organized as 512M x 8. This configuration provides a large storage capacity while maintaining efficient data access patterns.
  • Parallel Interface: The parallel memory interface ensures high-speed data transfer, making it suitable for applications requiring rapid read and write operations.
  • Surface Mount Compatibility: The die package is designed for surface mount technology, allowing for compact and efficient PCB layouts.
  • Flexible Voltage Range: The device operates within a supply voltage range of 2.7V to 3.6V, providing flexibility in power supply design and compatibility with various power sources.
  • Environmental Compliance: The MT29F4G08ABAFAM70A3WC1 is REACH unaffected and ROHS3 compliant, ensuring it meets the latest environmental and safety standards.
  • Moisture Sensitivity Level: With an MSL of 3 (168 hours), the device is well-suited for various manufacturing processes, ensuring reliability and longevity.

MT29F4G08ABAFAM70A3WC1 Applications

The MT29F4G08ABAFAM70A3WC1 is ideal for a wide range of applications that require high-density, non-volatile memory solutions. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems where large storage capacity and high-speed data access are critical.
  • Industrial Applications: Suitable for industrial control systems, where reliability and performance are paramount.
  • Consumer Electronics: Can be used in consumer electronics devices that require non-volatile memory for data storage and retrieval.
  • Automotive: Applicable in automotive systems for storing firmware and critical data.
  • Telecommunications: Useful in telecommunications equipment for storing configuration data and firmware.

Conclusion of MT29F4G08ABAFAM70A3WC1

The MT29F4G08ABAFAM70A3WC1 is a versatile and high-performance Flash memory IC that offers significant advantages over similar models. Its large memory size, parallel interface, and surface mount compatibility make it an excellent choice for applications requiring high-density, non-volatile memory solutions. The device's environmental compliance and moisture sensitivity level ensure reliability and longevity in various manufacturing processes. Whether used in embedded systems, industrial applications, consumer electronics, automotive systems, or telecommunications equipment, the MT29F4G08ABAFAM70A3WC1 provides a reliable and efficient memory solution.

FAQ

What operating temperature range does MT29F4G08ABAFAM70A3WC1 support?
MT29F4G08ABAFAM70A3WC1 has an operating temperature range of -40°C ~ 105°C (TC).
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