Micron Technology_MT29F4T08EMLCHD4-QC:C
Micron Technology_MT29F4T08EMLCHD4-QC:C
original

Micron Technology
MT29F4T08EMLCHD4-QC:C

774-MT29F4T08EMLCHD4-QC:C
TLC 4T 512GX8 FBGA QDP

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Tech Specifications

Series
-
REACH Status
REACH Unaffected
Mfr
Micron Technology Inc.
Package
Box
Product Status
Active
FBGA Marking Code
NY187

MT29F4T08EMLCHD4-QC:C Description

MT29F4T08EMLCHD4-QC:C Description

The MT29F4T08EMLCHD4-QC:C is a high-performance TLC 4T 512GX8 Flash Memory IC, designed and manufactured by Micron Technology Inc. This advanced memory solution is packaged in a FBGA QDP format, making it ideal for applications requiring high-density storage in a compact form factor. The product is currently active in the market and is unaffected by REACH regulations, ensuring compliance with environmental standards.

MT29F4T08EMLCHD4-QC:C Features

  • High-Density Storage: The MT29F4T08EMLCHD4-QC:C offers a substantial 512GB of storage capacity, leveraging TLC (Triple-Level Cell) technology to maximize data density while maintaining reliability.
  • 4T Architecture: This memory IC utilizes a 4T (4 Transistor) architecture, which enhances performance and efficiency, making it suitable for demanding applications.
  • FBGA QDP Packaging: The FBGA QDP package ensures robust mechanical stability and thermal performance, ideal for high-density and high-performance applications.
  • Active Product Status: As an active product, the MT29F4T08EMLCHD4-QC:C benefits from ongoing support and development, ensuring long-term availability and compatibility.
  • REACH Compliance: Being REACH unaffected, this product adheres to stringent environmental regulations, making it suitable for global markets.
  • DigiKey Programmability: While the DigiKey programmability status is not verified, the MT29F4T08EMLCHD4-QC:C maintains flexibility for customization and integration into various systems.

MT29F4T08EMLCHD4-QC:C Applications

The MT29F4T08EMLCHD4-QC:C is versatile and suitable for a wide range of applications, including:

  • Consumer Electronics: Ideal for high-capacity storage needs in devices such as smartphones, tablets, and digital cameras, where space is limited but storage demands are high.
  • Industrial Systems: Perfect for industrial applications requiring reliable and high-density storage solutions, such as embedded systems, IoT devices, and industrial control units.
  • Automotive: Suitable for automotive applications where robustness and high-density storage are crucial, such as infotainment systems and advanced driver assistance systems (ADAS).
  • Data Centers: The high-density storage capability makes it an excellent choice for data center applications, where large amounts of data need to be stored and accessed quickly.

Conclusion of MT29F4T08EMLCHD4-QC:C

The MT29F4T08EMLCHD4-QC:C from Micron Technology Inc. stands out as a superior choice for applications requiring high-density storage in a compact and reliable package. Its TLC 4T architecture and FBGA QDP packaging offer significant performance benefits, making it ideal for consumer electronics, industrial systems, automotive applications, and data centers. With its active product status and REACH compliance, the MT29F4T08EMLCHD4-QC:C ensures long-term availability and environmental sustainability. This memory IC is a testament to Micron Technology's commitment to innovation and excellence in the memory solutions market.

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