Micron Technology_MT29F64G08CBAAAL74A3WC1P
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Micron Technology
MT29F64G08CBAAAL74A3WC1P

774-MT29F64G08CBAAAL74A3WC1P
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IC FLASH 64GBIT PARALLEL DIE

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Tech Specifications

Part Status Code
Obsolete
HTS
COMPONENTS
Component Density
64Gb
I/O Voltage
3.3 VOLTS
Number of Components
1
PPAP
No
Memory Type
Non-Volatile
Product Status
Obsolete
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MT29F64G08CBAAAL74A3WC1P Description

MT29F64G08CBAAAL74A3WC1P Description

The MT29F64G08CBAAAL74A3WC1P is a high-performance, 64Gbit Flash memory IC chip designed by Micron Technology Inc. This device is organized as 8G x 8, offering significant storage capacity in a compact die package. The memory interface is parallel, ensuring fast data transfer rates and efficient performance in various applications. The operating temperature range of 0°C to 70°C (TA) makes it suitable for a wide range of environments, from industrial to consumer electronics.

MT29F64G08CBAAAL74A3WC1P Features

  • Memory Size and Organization: The MT29F64G08CBAAAL74A3WC1P features a 64Gbit memory size, organized as 8G x 8, providing substantial storage capacity for large datasets and complex applications.
  • Memory Interface: The parallel memory interface ensures high-speed data transfer, making it ideal for applications requiring rapid data processing and storage.
  • Operating Temperature: With an operating temperature range of 0°C to 70°C (TA), this IC can perform reliably in various environmental conditions, enhancing its versatility.
  • Voltage Supply: The device operates within a voltage range of 2.7V to 3.6V, ensuring compatibility with a wide range of power supply configurations.
  • Mounting Type: The surface mount mounting type allows for efficient integration into modern electronic designs, optimizing space utilization and reducing overall system size.
  • Compliance and Status: The MT29F64G08CBAAAL74A3WC1P is REACH unaffected and ROHS3 compliant, adhering to stringent environmental and safety standards. It also holds an ECCN classification of 3A991B1A, ensuring compliance with export regulations.
  • Packaging: The die package and tray packaging options provide flexibility in handling and integration, making it suitable for both small-scale and large-scale production environments.

MT29F64G08CBAAAL74A3WC1P Applications

The MT29F64G08CBAAAL74A3WC1P is well-suited for a variety of applications due to its high memory capacity, fast data transfer rates, and reliable performance. Some specific use cases include:

  • Industrial Automation: The robust operating temperature range and high memory capacity make it ideal for industrial control systems, where reliable data storage and rapid processing are critical.
  • Consumer Electronics: The compact die package and surface mount mounting type allow for seamless integration into consumer devices, such as smartphones, tablets, and gaming consoles, enhancing their storage capabilities.
  • Embedded Systems: The parallel memory interface and high-speed performance make it a suitable choice for embedded systems in automotive, aerospace, and medical devices, where fast data access and storage are essential.
  • Data Storage Solutions: The large memory size and reliable performance make it a valuable component in data storage solutions, such as SSDs and other storage devices, ensuring efficient data management and retrieval.

Conclusion of MT29F64G08CBAAAL74A3WC1P

The MT29F64G08CBAAAL74A3WC1P is a versatile and high-performance Flash memory IC chip that offers significant storage capacity and fast data transfer rates. Its wide operating temperature range, compact die package, and surface mount mounting type make it suitable for a variety of applications, from industrial automation to consumer electronics. The device’s compliance with environmental and safety standards ensures its suitability for modern electronic designs. Despite its obsolete status, the MT29F64G08CBAAAL74A3WC1P remains a reliable and efficient solution for applications requiring large memory storage and fast data processing.

FAQ

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MT29F64G08CBAAAL74A3WC1P is available in the Die package / case.
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