Micron Technology
MT29F64G08CBCGBL04A3WC1-M

774-MT29F64G08CBCGBL04A3WC1-M
IC FLASH 64GBIT PARALLEL DIE
2 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
8G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
Die
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MT29F64G08CBCGBL04A3WC1-M Description

MT29F64G08CBCGBL04A3WC1-M Description

The MT29F64G08CBCGBL04A3WC1-M is a high-performance, 64Gbit Flash memory IC designed by Micron Technology Inc. This device is engineered to provide robust and reliable storage solutions for a variety of applications. It features a parallel memory interface, making it suitable for systems requiring high-speed data transfer and efficient memory access. The memory organization of 8G x 8 ensures optimal data management and scalability. The device operates within a voltage range of 2.7V to 3.6V, ensuring compatibility with a wide range of power supplies. It is housed in a surface-mount die package, which is ideal for compact and space-efficient designs. The operating temperature range of 0°C to 70°C (TA) ensures reliable performance in various environmental conditions.

MT29F64G08CBCGBL04A3WC1-M Features

  • Memory Size: 64Gbit, providing substantial storage capacity for complex applications.
  • Memory Interface: Parallel, enabling high-speed data transfer and efficient memory access.
  • Memory Organization: 8G x 8, ensuring optimal data management and scalability.
  • Operating Temperature: 0°C to 70°C (TA), ensuring reliable performance in various environmental conditions.
  • Voltage - Supply: 2.7V to 3.6V, ensuring compatibility with a wide range of power supplies.
  • Mounting Type: Surface Mount, ideal for compact and space-efficient designs.
  • Package / Case: Die, offering flexibility in system integration.
  • Moisture Sensitivity Level (MSL): 3 (168 Hours), ensuring durability and reliability in manufacturing processes.
  • Compliance: REACH Unaffected and ROHS3 Compliant, meeting global environmental and safety standards.
  • ECCN: 3A991B1A, ensuring compliance with export regulations.
  • HTSUS: 8542.32.0071, facilitating accurate customs classification.

MT29F64G08CBCGBL04A3WC1-M Applications

The MT29F64G08CBCGBL04A3WC1-M is ideal for applications requiring high-density, non-volatile memory solutions. Its parallel interface and large memory size make it suitable for:

  • Embedded Systems: Providing reliable storage for firmware and critical data in embedded devices.
  • Industrial Control Systems: Ensuring robust and durable memory solutions in harsh industrial environments.
  • Networking Equipment: Offering high-speed data transfer capabilities for network routers and switches.
  • Consumer Electronics: Enhancing the storage capacity of devices such as smart TVs, gaming consoles, and digital cameras.
  • Automotive Systems: Providing reliable memory for automotive infotainment and control systems.

Conclusion of MT29F64G08CBCGBL04A3WC1-M

The MT29F64G08CBCGBL04A3WC1-M from Micron Technology Inc. is a versatile and high-performance Flash memory IC that stands out for its large memory size, parallel interface, and reliable operating characteristics. Its surface-mount die package and wide operating temperature range make it suitable for a variety of applications, from consumer electronics to industrial control systems. The device's compliance with global environmental and safety standards ensures it meets the needs of modern, environmentally conscious design requirements. Overall, the MT29F64G08CBCGBL04A3WC1-M is an excellent choice for designers seeking a robust, high-density memory solution for their next project.

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