Micron Technology_MT49H8M36BM-33:B TR
Micron Technology_MT49H8M36BM-33:B TR
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Micron Technology
MT49H8M36BM-33:B TR

774-MT49H8M36BM-33:B TR
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IC DRAM 288MBIT PARALLEL 144UBGA

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Tech Specifications

Clock Frequency
300 MHz
Memory Type
Volatile
Product Status
Obsolete
Supplier Device Package
144-µBGA (18.5x11)
Access Time
20 ns
Package / Case
144-TFBGA
Technology
DRAM
Voltage - Supply
1.7V ~ 1.9V
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MT49H8M36BM-33:B TR Description

MT49H8M36BM-33:B TR Description

The MT49H8M36BM-33:B TR is a high-performance, 288 Mbit DRAM memory IC chip designed for demanding applications requiring fast data access and reliable performance. Manufactured by Micron Technology Inc., this chip features a parallel memory interface and is packaged in a 144-ball BGA format, ensuring efficient integration into modern electronic systems. With a clock frequency of 300 MHz and an access time of 20 ns, the MT49H8M36BM-33:B TR delivers rapid data processing capabilities, making it suitable for high-speed computing environments.

MT49H8M36BM-33:B TR Features

  • Memory Organization: The MT49H8M36BM-33:B TR is organized as 8M x 36, providing a total memory size of 288 Mbit. This configuration ensures efficient data storage and retrieval, ideal for applications requiring large amounts of memory.
  • Performance: With a clock frequency of 300 MHz and an access time of 20 ns, this DRAM chip offers high-speed data access, enabling rapid processing and reduced latency.
  • Power Efficiency: The chip operates within a voltage range of 1.7V to 1.9V, ensuring low power consumption and efficient energy use, which is crucial for battery-operated and energy-sensitive applications.
  • Reliability: The MT49H8M36BM-33:B TR is designed to operate within a temperature range of 0°C to 95°C, making it suitable for a wide range of environmental conditions. Additionally, it has a moisture sensitivity level (MSL) of 3, allowing for a 168-hour exposure time, ensuring robustness in various manufacturing and operational environments.
  • Compliance: The chip is REACH unaffected and ROHS3 compliant, meeting stringent environmental and safety regulations, making it suitable for global markets.
  • Mounting and Packaging: The surface mount technology (SMT) and tape & reel (TR) packaging ensure ease of integration into automated assembly processes, reducing production costs and improving manufacturing efficiency.

MT49H8M36BM-33:B TR Applications

The MT49H8M36BM-33:B TR is ideal for applications that require high-speed data processing and large memory capacity. Some specific use cases include:

  • Networking Equipment: Routers, switches, and other networking devices benefit from the fast data access and large memory capacity of the MT49H8M36BM-33:B TR, ensuring efficient data handling and reduced latency.
  • Telecommunications: Base stations and other telecom infrastructure can leverage the high-performance capabilities of this DRAM chip to manage large volumes of data and ensure reliable communication.
  • Industrial Control Systems: Automation and control systems in industrial environments require robust and high-speed memory solutions to process real-time data, making the MT49H8M36BM-33:B TR an ideal choice.
  • Embedded Systems: High-performance embedded systems, such as automotive infotainment systems and advanced driver-assistance systems (ADAS), can benefit from the fast access times and large memory capacity of this DRAM chip.

Conclusion of MT49H8M36BM-33:B TR

The MT49H8M36BM-33:B TR is a versatile and high-performance DRAM memory IC chip that offers significant advantages over similar models. Its fast access times, large memory capacity, and low power consumption make it an ideal solution for a wide range of applications, particularly in networking, telecommunications, industrial control, and embedded systems. Despite being marked as obsolete, the MT49H8M36BM-33:B TR remains a reliable and efficient choice for applications requiring robust and high-speed memory solutions.

FAQ

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