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MT53B256M32D1DS-062 XT:C TR

MT53B256M32D1DS-062 XT:C TR Description

The MT53B256M32D1DS-062 XT:C TR is an 8Gbit DRAM memory IC chip designed by Micron Technology Inc. This high-performance memory module is organized as 256M x 32, offering a substantial storage capacity and data bandwidth. It operates at a clock frequency of 1.6 GHz, ensuring rapid data processing and transfer speeds. The chip is housed in a 200-ball fine-pitch ball grid array (200WFBGA) package, which is ideal for surface mount applications, providing robust mechanical stability and efficient thermal management.

MT53B256M32D1DS-06 XT2:C TR Features

• High-Speed Performance: With a clock frequency of 1.6 GHz, the MT53B256M32D1DS-062 XT:C TR delivers exceptional speed and efficiency, making it suitable for demanding applications requiring rapid data access and processing.
• Volatile Memory: As a DRAM device, it provides volatile memory storage, which is essential for applications where data needs to be quickly read and written.
• Surface Mount Technology: The surface mount mounting type ensures ease of integration into modern electronic systems, enhancing reliability and reducing the overall footprint of the design.
• Low Voltage Operation: The chip operates at a supply voltage of 1.1V, contributing to energy efficiency and reduced power consumption, which is crucial for battery-operated and low-power systems.
• Compliance and Safety: The MT53B256M32D1DS-062 XT:C TR is REACH unaffected and ROHS3 compliant, ensuring it meets the highest environmental and safety standards.
• Moisture Sensitivity Level: With an MSL rating of 3 (168 hours), the chip is well-suited for environments with varying humidity levels, providing a balance between protection and cost-effectiveness.
• Packaging: The tape and reel (TR) packaging format facilitates efficient handling and automated assembly processes, making it ideal for large-scale production.

MT53B256M32D1DS-062 XT:C TR Applications

The MT53B256M32D1DS-062 XT:C TR is ideal for a variety of high-performance computing applications, including:

• Servers and Workstations: Its high-speed and large memory capacity make it suitable for data-intensive tasks such as data processing, analytics, and virtualization.
• Networking Equipment: The chip's rapid data transfer capabilities are beneficial for routers, switches, and other networking devices that require quick data handling.
• Embedded Systems: The low voltage operation and surface mount design make it a good fit for embedded systems where power efficiency and compactness are critical.
• Consumer Electronics: High-performance gaming consoles, multimedia devices, and other consumer electronics can benefit from the fast access times and large storage capacity provided by this DRAM module.

Conclusion of MT53B256M32D1DS-062 XT:C TR

The MT53B256M32D1DS-062 XT:C TR from Micron Technology Inc. is a high-performance DRAM memory IC chip that offers a combination of speed, capacity, and efficiency. Its 1.6 GHz clock frequency and 8Gbit memory size make it a powerful component for a wide range of applications, from servers to embedded systems. Despite being marked as obsolete, its technical specifications and compliance with industry standards ensure it remains a reliable choice for systems requiring robust and efficient memory solutions.