Micron Technology_MT53B256M32D1TG-062 XT:C
Micron Technology_MT53B256M32D1TG-062 XT:C
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Micron Technology
MT53B256M32D1TG-062 XT:C

774-MT53B256M32D1TG-062 XT:C
IC DRAM 8GBIT 1.6GHZ

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Tech Specifications

Clock Frequency
1.6 GHz
HTS
EA
ECCN (US)
EAR99
PPAP
No
Memory Type
Volatile
Product Status
Obsolete
Supplier Device Package
-
Automotive
No
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MT53B256M32D1TG-062 XT:C Description

MT53B256M32D1TG-062 XT:C Description

The MT53B256M32D1TG-062 XT:C is an 8Gbit DRAM memory IC chip designed by Micron Technology Inc., a leading manufacturer in the semiconductor industry. This chip features a memory organization of 256M x 32, providing a robust and efficient solution for high-density memory storage. With a clock frequency of 1.6 GHz, it ensures fast data access and processing speeds, making it suitable for demanding applications that require high performance. The memory type is volatile, meaning it retains data only when power is supplied, which is typical for DRAM technology. The supply voltage is 1.1V, contributing to its energy efficiency. This product is packaged in a tray format and has a moisture sensitivity level (MSL) of 3, allowing for a 168-hour exposure time before assembly. Despite its obsolescence, the MT53B256M32D1TG-062 XT:C remains a reliable choice for specific legacy systems and applications.

MT53B256M32D1TG-062 XT:C Features

  • High Memory Density: With a memory size of 8Gbit organized as 256M x 32, this DRAM chip provides substantial storage capacity in a compact form factor.
  • Fast Performance: The 1.6 GHz clock frequency ensures rapid data access and processing, making it ideal for applications requiring high-speed memory solutions.
  • Energy Efficiency: Operating at a supply voltage of 1.1V, it offers energy-efficient performance, which is crucial for systems with power constraints.
  • Robust Packaging: The tray packaging format ensures safe handling and storage, while the MSL 3 rating allows for extended exposure time before assembly, enhancing flexibility in manufacturing processes.
  • Compliance and Safety: The MT53B256M32D1TG-062 XT:C is REACH unaffected and RoHS3 compliant, meeting stringent environmental and safety standards in the electronics industry.
  • Legacy Support: Despite being marked as obsolete, this chip continues to support legacy systems and applications where its specific features are still required.

MT53B256M32D1TG-06 XT2:C Applications

The MT53B256M32D1TG-062 XT:C is well-suited for a variety of applications that demand high-density, high-speed memory solutions. Some specific use cases include:

  • Networking Equipment: Ideal for routers, switches, and other networking devices that require fast data processing and storage.
  • Telecommunications: Suitable for base stations and other telecommunication infrastructure that need reliable and high-performance memory.
  • Industrial Control Systems: Provides robust memory solutions for industrial automation and control systems where data integrity and speed are critical.
  • Legacy Systems: Continues to support older systems and applications that rely on this specific DRAM configuration.

Conclusion of MT53B256M32D1TG-062 XT:C

The MT53B256M32D1TG-062 XT:C, despite its obsolescence, remains a valuable component in the electronics industry due to its high memory density, fast performance, and energy efficiency. Its compliance with environmental and safety standards ensures its suitability for modern manufacturing processes. While newer technologies may offer enhanced features, the MT53B256M32D1TG-062 XT:C continues to provide reliable performance for legacy systems and specific applications where its unique attributes are still in demand.

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