Micron Technology Tariff Inquiry

MT53B384M32D2NP-062 XT:B

MT53B384M32D2NP-062 XT:B Description

The MT53B384M32D2NP-062 XT:B is a high-performance DRAM memory IC chip manufactured by Micron Technology Inc. This 12Gbit memory device is designed for demanding applications requiring high-speed data processing and large memory capacity. The memory is organized as 384M x 32, offering a robust architecture for efficient data storage and retrieval. With a clock frequency of 1.6 GHz, this IC ensures rapid data access and processing, making it suitable for high-performance computing environments.

The MT53B384M32D2NP-062 XT:B features a 1.1V supply voltage, which not only enhances energy efficiency but also reduces power consumption, making it ideal for systems where power management is critical. The memory is volatile, meaning it retains data only while powered, which is advantageous for applications requiring frequent data updates and dynamic memory allocation.

This memory IC is packaged in a 200-ball fine-pitch ball grid array (200WFBGA), which supports surface-mount technology (SMT). The surface-mount mounting type ensures a compact and reliable design, suitable for modern electronic systems where space is a premium. The memory chip is also compliant with industry standards such as REACH and RoHS3, ensuring environmental safety and regulatory compliance.

MT53B384M32D2NP-062 XT:B Features

• High-Speed Performance: With a clock frequency of 1.6 GHz, the MT53B384M32D2NP-062 XT:B delivers rapid data access and processing capabilities, essential for high-performance computing applications.
• Large Memory Capacity: The 12Gbit memory size, organized as 384M x 32, provides ample storage for complex data sets and large-scale applications.
• Energy Efficiency: The 1.1V supply voltage reduces power consumption, making this memory IC suitable for systems where energy efficiency is crucial.
• Surface-Mount Technology: The 200WFBGA package supports surface-mount mounting, ensuring a compact and reliable design for modern electronic systems.
• Regulatory Compliance: The MT53B384M32D2NP-062 XT:B is REACH unaffected and RoHS3 compliant, ensuring environmental safety and adherence to industry standards.
• Moisture Sensitivity Level: The MSL 3 (168 Hours) rating ensures the device can withstand certain environmental conditions during manufacturing and storage processes.

MT53B384M32D2NP-062 XT:B Applications

The MT53B384M32D2NP-062 XT:B is ideal for a range of applications that demand high-speed data processing and large memory capacity. Some specific use cases include:

• High-Performance Computing: Ideal for servers and data centers where rapid data access and processing are critical.
• Networking Equipment: Suitable for routers and switches that require high-speed memory to handle large volumes of data traffic.
• Telecommunications: Applicable in base stations and other telecom equipment that need efficient data handling and storage.
• Industrial Automation: Useful in control systems and automation equipment where real-time data processing is essential.

Conclusion of MT53B384M32D2NP-062 XT:B

The MT53B384M32D2NP-062 XT:B is a high-performance DRAM memory IC that offers a combination of large memory capacity, high-speed data processing, and energy efficiency. Its 12Gbit memory size and 1.6 GHz clock frequency make it suitable for demanding applications in high-performance computing, networking, telecommunications, and industrial automation. The device's compliance with industry standards such as REACH and RoHS3 ensures environmental safety and regulatory adherence. Despite being an obsolete product, the MT53B384M32D2NP-062 XT:B remains a reliable choice for applications requiring robust and efficient memory solutions.