Micron Technology Tariff Inquiry

MT53D384M32D2DS-053 XT:E

MT53D384M32D2DS-053 XT:E Description

The MT53D384M32D2DS-053 XT:E is a high-performance memory IC chip manufactured by Micron Technology Inc., a leading provider of advanced semiconductor solutions. This IC features a 12Gbit memory size organized in a 384M x 32 configuration, making it suitable for applications requiring substantial data storage and fast access times. The chip operates at a clock frequency of 1.866 GHz, ensuring rapid data processing capabilities. It is designed for surface mount technology, utilizing a 200-ball fine-pitch ball grid array (200WFBGA) package, which is ideal for compact and high-density PCB designs.

MT53D384M32D2DS-053 XT:E Features

• Memory Organization: The MT53D384M32D2DS-053 XT:E features a 384M x 32 memory organization, providing a total memory size of 12Gbit. This configuration is optimal for applications requiring large data sets and high-speed processing.
• Clock Frequency: With a clock frequency of 1.866 GHz, this IC ensures fast data transfer rates and efficient performance, crucial for high-speed computing and data-intensive applications.
• Volatile Memory: As a DRAM (Dynamic Random Access Memory) device, it offers volatile memory storage, which is ideal for temporary data storage and high-speed data access.
• Supply Voltage: The IC operates at a supply voltage of 1.1V, contributing to energy efficiency and reduced power consumption, which is beneficial for both performance and environmental sustainability.
• Mounting Type: The surface mount technology (SMT) allows for easy integration into modern PCB designs, ensuring compatibility with contemporary manufacturing processes.
• Moisture Sensitivity Level (MSL): With an MSL rating of 3 (168 hours), the IC is well-suited for various environmental conditions, ensuring reliability and durability in diverse applications.
• Compliance: The MT53D384M32D2DS-053 XT:E is REACH unaffected and RoHS3 compliant, adhering to stringent environmental and safety standards, making it suitable for a wide range of industries.

MT53D384M32D2DS-053 XT:E Applications

The MT53D384M32D2DS-053 XT:E is designed for applications that demand high-speed data processing and substantial memory capacity. Its high clock frequency and large memory size make it ideal for:

• High-Performance Computing: Suitable for servers and workstations requiring rapid data access and processing.
• Data Centers: Ideal for data storage and retrieval systems that need to handle large volumes of data efficiently.
• Telecommunications: Beneficial for networking equipment that requires fast data transfer and low latency.
• Consumer Electronics: Can be used in high-end gaming consoles and multimedia devices where fast memory access is crucial for performance.

Conclusion of MT53D384M32D2DS-053 XT:E

The MT53D384M32D2DS-053 XT:E from Micron Technology Inc. is a robust and efficient memory IC chip, offering a combination of high memory capacity, fast clock frequency, and energy-efficient operation. Its surface mount technology and compliance with environmental standards make it a versatile and reliable choice for a variety of applications. Despite being marked as obsolete, the MT53D384M32D2DS-053 XT:E remains a valuable component for systems that require high-speed, high-capacity DRAM solutions.