Micron Technology_MT53D512M32D2DS-046 WT:D TR
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Micron Technology
MT53D512M32D2DS-046 WT:D TR

774-MT53D512M32D2DS-046 WT:D TR
IC DRAM 16GBIT 2.133GHZ 200WFBGA

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Tech Specifications

Clock Frequency
2.133 GHz
Operating Temperature
-30°C ~ 85°C (TC)
Memory Interface
-
ECCN
EAR99
Memory Organization
512M x 32
Mounting Type
Surface Mount
Memory Type
Volatile
Product Status
Obsolete
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MT53D512M32D2DS-046 WT:D TR Description

MT53D512M32D2DS-046 WT:D TR Description

The MT53D512M32D2DS-046 WT:D TR is a high-performance, 16Gbit DRAM memory IC designed by Micron Technology Inc. This device features a 512M x 32 memory organization, offering substantial storage capacity in a compact form factor. The IC operates at a clock frequency of 2.133 GHz, ensuring rapid data access and transfer speeds, which are critical for demanding applications requiring high bandwidth and low latency.

This memory IC is packaged in a 200-ball fine-pitch BGA (200WFBGA) format, making it suitable for surface mount technology (SMT) applications. The supply voltage is set at 1.1V, which helps in reducing power consumption while maintaining high performance. The MT53D512M32D2DS-046 WT:D TR is also RoHS3 compliant, adhering to stringent environmental standards and ensuring it is free from harmful substances.

MT53D512M32D2DS-046 WT:D TR Features

  • High Capacity and Bandwidth: With a memory size of 16Gbit and a clock frequency of 2.133 GHz, this DRAM IC provides significant storage and fast data processing capabilities.
  • Compact and Efficient Packaging: The 200WFBGA package is ideal for surface mount applications, allowing for high-density board layouts and efficient use of space.
  • Low Power Consumption: Operating at 1.1V, the MT53D512M32D2DS-046 WT:D TR ensures minimal power usage, which is crucial for energy-efficient designs.
  • Environmental Compliance: RoHS3 compliance guarantees that the product meets the latest environmental regulations, making it suitable for a wide range of applications.
  • Moisture Sensitivity Level (MSL) 3: This level indicates that the component can withstand up to 168 hours of exposure to standard environmental conditions, ensuring reliability and longevity.
  • Tape & Reel Packaging: The MT53D512M32D2DS-046 WT:D TR is available in tape & reel (TR) packaging, facilitating automated assembly processes and ensuring consistent quality.

MT53D512M32D2DS-046 WT:D TR Applications

The MT53D512M32D2DS-046 WT:D TR is well-suited for a variety of applications where high-speed, high-capacity memory is required. Some specific use cases include:

  • High-Performance Computing: Ideal for servers and data centers that require rapid data processing and large memory storage.
  • Networking Equipment: Suitable for routers, switches, and other networking devices that need to handle high volumes of data traffic.
  • Consumer Electronics: Applicable in advanced gaming consoles, multimedia devices, and smart TVs that demand high performance and low power consumption.
  • Industrial Automation: Useful in control systems and monitoring equipment that require reliable and efficient memory solutions.

Conclusion of MT53D512M32D2DS-046 WT:D TR

The MT53D512M32D2DS-046 WT:D TR from Micron Technology Inc. is a robust and efficient DRAM memory IC designed to meet the demands of modern high-performance applications. Its high capacity, fast clock frequency, and low power consumption make it an excellent choice for a wide range of industries. The compact 200WFBGA package and RoHS3 compliance further enhance its suitability for various applications. Despite being marked as obsolete, the MT53D512M32D2DS-046 WT:D TR remains a reliable and powerful memory solution for those who require its specific technical attributes.

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