Micron Technology_MT53D512M32D2DS-053 WT:D

Micron Technology
MT53D512M32D2DS-053 WT:D  
Memory ICs Products

Micron Technology
MT53D512M32D2DS-053 WT:D
774-MT53D512M32D2DS-053 WT:D
IC DRAM 16GBIT 1.866GHZ 200WFBGA
In Stock : 10

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MT53D512M32D2DS-053 WT:D Description

MT53D512M32D2DS-053 WT:D Description

The MT53D512M32D2DS-053 WT:D is a high-performance DRAM memory IC chip manufactured by Micron Technology Inc. This 16Gbit DRAM device is organized as 512M x 32, providing substantial memory capacity for demanding applications. It operates at a clock frequency of 1.866 GHz, ensuring rapid data processing and high throughput. The memory is volatile, meaning it requires a constant power supply to retain data, and it operates at a supply voltage of 1.1V, which is energy-efficient and suitable for low-power systems.

This IC is packaged in a 200-ball fine-pitch ball grid array (200WFBGA) and is designed for surface mount applications, making it ideal for compact and high-density PCB designs. It is categorized under Memory IC Chips and is currently marked as obsolete, indicating that it may no longer be in active production but could still be available for specific legacy applications.

MT53D512M32D2DS-053 WT:D Features

  • High Memory Capacity: With a memory size of 16Gbit organized as 512M x 32, the MT53D512M32D2DS-053 WT:D offers significant storage for data-intensive applications.
  • Fast Performance: The clock frequency of 1.866 GHz ensures high-speed data processing, making it suitable for applications requiring rapid data access and manipulation.
  • Low Power Consumption: Operating at a supply voltage of 1.1V, this DRAM IC is energy-efficient, which is crucial for battery-operated or power-sensitive systems.
  • Surface Mount Compatibility: The 200WFBGA package is designed for surface mount technology, allowing for high-density and compact PCB designs.
  • Compliance and Safety: The MT53D512M32D2DS-053 WT:D is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and safety standards.
  • Moisture Sensitivity Level: With an MSL of 3 (168 hours), the IC is suitable for environments with moderate humidity, ensuring reliability and longevity.

MT53D512M32D2DS-053 WT:D Applications

The MT53D512M32D2DS-053 WT:D is ideal for a variety of applications where high memory capacity and fast data processing are required. Some specific use cases include:

  • Data Centers: High-density memory solutions are essential for servers and data storage systems, where large amounts of data need to be processed quickly.
  • Networking Equipment: Routers and switches benefit from the high-speed data access capabilities of this DRAM IC, ensuring efficient data routing and handling.
  • Consumer Electronics: High-performance gaming consoles and multimedia devices can leverage the fast performance and large memory capacity for seamless user experiences.
  • Industrial Automation: Control systems and industrial computers require reliable and high-speed memory to manage complex processes and data logging.

Conclusion of MT53D512M32D2DS-053 WT:D

The MT53D512M32D2DS-053 WT:D, manufactured by Micron Technology Inc., is a powerful and efficient DRAM memory IC chip. Its high memory capacity, fast clock frequency, and low power consumption make it a suitable choice for a wide range of applications, from data centers to consumer electronics. Despite its obsolete status, the MT53D512M32D2DS-053 WT:D remains a reliable option for legacy systems and specific applications where its unique features and performance benefits are still highly valued.

Tech Specifications

Clock Frequency
Operating Temperature
Memory Interface
ECCN
Memory Organization
Mounting Type
Memory Type
Product Status
Supplier Device Package
Series
Write Cycle Time - Word, Page
Memory Size
Package / Case
Technology
Voltage - Supply
REACH Status
Mfr
HTSUS
Package
Memory Format
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Organization
PCB changed
HTS
ECCN (US)
PPAP
Data Bus Width (bit)
Operating Current (mA)
Number of Internal Banks
Automotive
Address Bus Width (bit)
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Supplier Package
DRAM Type
Chip Density (bit)
Process Technology
Number of Words per Bank
Package Height
Maximum Operating Supply Voltage (V)
Maximum Clock Rate (MHz)
EU RoHS
Maximum Access Time (ns)
Number of Bits/Word (bit)
Number of I/O Lines (bit)
Package Length
Standard Package Name
Pin Count
Mounting
Lead Shape
Part Status
Typical Operating Supply Voltage (V)
Package Width
Minimum Operating Supply Voltage (V)

MT53D512M32D2DS-053 WT:D Documents

Download datasheets and manufacturer documentation for MT53D512M32D2DS-053 WT:D

Shopping Guide

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